Lg Innotek Co., Ltd.

Suzhou Lekin Semiconductor Co., Ltd.

Lg Electronics Inc.

Tae Sung Lee

June O Song

Chang Man Lim

Jong Beom Choi

Sung Min Hwang

Ki Seok Kim

Min Ji Jin

Se Yeon Jung

Byung Yeon Choi

Young Shin Kim

Jae Hwan Jung

Chang Hyeong Lee

Young Min Ryu

Won Jung Kim

Sung Min Kong

Young Kyu Jeong

Joo Hyun Park

Ju Hyeon Oh

Jang Hoon Jeong

The present disclosure provides a terminal set including an extended display and, more specifically, a terminal set having a main body and a sub body fastened to each other. The terminal set includes an inclination sensor mounted on the main body so as to sense the inclination of the main body, and a controller for executing an application and thereby controlling a first display of the main body or a second display of the sub body so as to output the application. If the controller receives a new output signal regarding a first application in a state in which the sensed inclination of the main body is within a screen rotation nonactivation range, the controller retrieves an output rotation value allocated to the first display and an output rotation value allocated to the second display.

Terminal set comprising two adjacent displays, and method for controlling an output of the adjacent displays

A semiconductor device according to an embodiment may include: a light emitting structure; a light transmitting electrode layer disposed on the light emitting structure; and a reflective layer disposed on the light transmitting electrode layer and including a plurality of first openings and a plurality of second openings. The semiconductor device according to the embodiment may include: a first electrode in contact with a first conductivity type semiconductor layer of the light emitting structure; and a second electrode in contact with the light transmitting electrode layer through the plurality of first openings. The first electrode may include a first sub-electrode and a plurality of first branch electrodes, wherein the plurality of first branch electrodes are arranged extending toward the second electrode from the first sub-electrode; the second electrode may include a second sub-electrode and a plurality of second branch electrodes, wherein the plurality of second branch electrodes are arranged extending toward the first electrode from the second sub-electrode; and the plurality of first branch electrodes and the plurality of second branch electrodes may be alternately disposed on an upper surface of the reflective layer.

Semiconductor device and semiconductor device package having an electrode recess with a different inclination angle than an inclination angle of an electrode in the recess

An embodiment relates to a light emitting module, a flash module, and a terminal including the same. The light emitting module according to an embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; a first partition arranged at one side of the plurality of light emitting chips, and a second partition arranged at the other side of the plurality of light emitting chips so as to face the first partition; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside, and is arranged on the inner side of the first and second partitions. The light emitting module according to the embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside.

Light emitting module, flash module, and terminal including same

A light emitting device package can include a package body; a light emitting device disposed on the package body and including first and second electrode pads on a bottom surface of the light emitting device; a first through hole in the package body; a second through hole in the package body, in which the first through hole is separated from the second through hole, the first electrode pad of the light emitting device directly overlaps with the first through hole in the package body, and the second electrode pad of the light emitting device directly overlaps with the second through hole in the package body.

Light emitting device package and light source apparatus

An embodiment may have a substrate () including a predetermined cavity (C); a plurality of light emitting chips () spaced apart from the cavity (C) of the substrate (); a frame (), disposed on the substrate () including a support portion () and a guide portion () including a predetermined through hole (H); and a lens unit () disposed in the through hole (H) of the guide portion ().

Flash module and terminal comprising same

A light emitting device package according to an embodiment includes: a package body; a light emitting device disposed on the package body; and an adhesive disposed between the package body and the light emitting device. The package body includes first and second openings passing through the package body on an upper surface of the package body and a recess provided to concave in a direction of a lower surface of the package body from the upper surface of the package body. The light emitting device includes a first bonding part disposed on the first opening and a second bonding part disposed on the second opening. The adhesive is provided at the recess.

Light emitting device package including a recess provided under a light emitting device and having a closed loop shape

A light emitting device package can include first and second frames spaced apart from each other; a package body including a body portion between the first and second frames; a light emitting device including first and second electrode pads; first and second through holes in the first and second frames, respectively; a first resin between the body portion and the light emitting device; and a conductive material in the first and second through holes, in which the first and second electrode pads of the light emitting device respectively overlap with the first and second through holes, the first and second electrode pads are spaced apart from each other, and the conductive material in the first and second through holes respectively contacts the first and second electrode pads, and a first side surface of the first electrode pad and a second side surface of the second electrode pad facing the first side surface both contact the first resin.

The light emitting device package disclosed in the embodiment includes: first and second frames having first and second through holes; a body disposed between the first and second frames; a light emitting device including a first bonding pad and a second bonding pad; and a conductive part in the first and second through holes. wherein at least one of the first and second bonding pads faces the first and second frames and overlaps with the first and second through holes and includes a contact region contacting the conductive part and a first non-contact non-contacting the conducive part.

Light emitting device and light emitting device package

A light emitting device package includes a first frame and a second frame disposed to be spaced apart from each other; a body disposed between the first and second frames and comprising a recess; a first adhesive on the recess; a light emitting device on the first adhesive; a second adhesive disposed between the first and second frames and the light emitting device; and a resin portion disposed to surround the second adhesive and a partial region of the light emitting device.

Light emitting device package

A light emitting device package according to an embodiment includes: a body including first and second openings passing through an upper surface of the body and a lower surface of the body; a light emitting device disposed on the body and including first and second bonding parts; and first and second conductive layers disposed under the body and electrically connected to the first and second bonding parts, respectively, wherein each of the first and second bonding parts includes a protrusion portion protruding and extending in a downwards direction within the first and second openings, respectively.

A light-emitting element disclosed in an embodiment comprises: a body having a cavity; first and second lead frames arranged in the cavity; a third lead frame arranged between the first and second lead frames in the cavity; a fourth lead frame arranged between the first and second lead frames and distanced from the third frame in the cavity; a first light-emitting chip arranged on the first lead frame; and a second light-emitting chip arranged on the second lead frame, wherein the body comprises: first and second sides arranged on opposing sides from each other; and third and fourth sides arranged on opposing sides from each other, the first lead frame comprises first and second lead parts protruding toward the first and second sides, the second lead frame comprises third and forth lead parts protruding toward the first and second sides, the third frame comprises a fifth lead part protruding toward the first side, and the fourth lead frame comprises a sixth lead part protruding toward the second side.

Light emitting device

A light emitting device is provided. The light emitting device may include a body, first and second lead frames coupled to the body, a first light emitting chip on the first lead frame, a second light emitting chip on the second lead frame, and a reflective frame on the body and the first and second lead frames. The reflective frame may include a first opening provided therein with the first light emitting chip and a second opening provided therein with the second light emitting chip.

Growing community of inventors

Seoul, South Korea

Tae Sung Lee