Samsung Electronics Co., Ltd.

Tae-Sub Chang

Dong-Ho Lee

Min-Young Son

A semiconductor chip package includes a ground metal layer disposed in close proximity to a signal layer for carrying electrical input and output signals to and from the chip. The ground metal layer has a plate structure and is formed by two metal plates or a single metal plate having openings for the electrode pads of the chip. Because the ground trace is nearest to the signal trace, the loop area formed by a signal current and its return current is reduced and, therefore, loop inductance is reduced as well. Further, because of the plate structure of the ground trace and its proximity to the signal trace, the inductive element and parasitic parameters due to the signal trace can be significantly reduced and the electrical performance of high-frequency semiconductor IC devices is greatly improved, especially when applied to wafer level packaging IC devices.

Wafer level package including ground metal layer

An electrical connection structure for electrically connecting a semiconductor chip to an external circuit device is provided. The connection structure comprises a ground conductive plate connected to ground power of the semiconductor chip; an insulating layer formed on the ground conductive plate; a signal pattern layer formed on the insulating layer and having signal patterns in electrical communication with the semiconductor chip. The ground conductive plate includes a projected blank pattern that is the complement of the signal pattern layer. With the present invention, self inductance and mutual inductance of the connection structure is reduced. Further, because of the blank patterns formed in the proximal ground plate, the capacitance is also reduced. Therefore, both the switching output noise and cross talk is simultaneously prevented in very high frequency operation and hence electrical characteristics and performance are significantly improved in package devices such as wafer level packages and ball grid array packages operating at high data rates.

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Seoul, South Korea

Tae-Sub Chang