Lg Innotek Co., Ltd.

Tae Su Yang

Jae Hyun Park

Jong Hyun Kim

Myoung Lae Roh

Boone Won

Young Sam Yoo

Hee Yol Jin

Kye Soo Jun

Youn Gyo Lee

A thermoelectric element according to an embodiment of the present invention comprises: a first electrode; a semiconductor structure disposed on the first electrode; and a second electrode disposed on the semiconductor structure, wherein the bottom surface of the second electrode includes an overlap area vertically overlapping the first electrode, the semiconductor structure includes a top surface opposite to the second electrode, and the center of the top surface of the semiconductor structure is arranged to be offset from the center of the overlap area.

Thermoelectric element

A thermoelectric element according to an embodiment of the present invention comprises: a first substrate; a first insulating layer disposed on the first substrate; a second insulating layer disposed on the first insulating layer; a first electrode disposed on the second insulating layer; a semiconductor structure disposed on the first electrode; a second electrode disposed on the semiconductor structure; and a second substrate disposed on the second electrode, wherein the composition of the first insulating layer is different from the composition of the second insulating layer, the first insulating layer includes a first region disposed on the first substrate and a second region disposed between the first region and the second insulating layer, and a particle size (D50) of an inorganic filler included in the second region is greater than the particle size (D50) of an inorganic filler included in the first region.

A thermoelectric element according to one embodiment of the present disclosure includes a first substrate, a first buffer layer disposed on the first substrate, a first electrode disposed on the first buffer layer, a P-type thermoelectric leg and an N-type thermoelectric leg disposed on the first electrode, a second electrode disposed on the P-type thermoelectric leg and the N-type thermoelectric leg, a second buffer layer disposed on the second electrode, and a second substrate disposed on the second buffer layer, wherein at least one of the first buffer layer and the second buffer layer includes a silicone resin and an inorganic material, and the Young's modulus of at least one of the first buffer layer and the second buffer layer is 1 to 65 MPa.

Thermoelectric device

A thermoelectric module according to one embodiment of the present invention comprises: a first metal substrate; a thermoelectric element; and a second metal substrate, wherein the thermoelectric element comprises a first resin layer, a plurality of first electrodes, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs, a plurality of second electrodes and a second resin layer, wherein the width of the first metal substrate is greater than the width of the second metal substrate, and the first metal substrate comprises a first surface in direct contact with the first resin layer and a second surface opposite to the first surface, and further comprises: a first support spaced apart from the thermoelectric element and a side surface of the second metal substrate on the first surface of the first metal substrate, and arranged so as to surround the thermoelectric element and the side surface of the second metal substrate; and a sealing material spaced apart from the thermoelectric element and the side surface of the second metal substrate, on the first surface of the first metal substrate, and arranged so as to surround the thermoelectric element and the side surface of the second metal substrate.

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Seoul, South Korea

Tae Su Yang