Samsung Sdi Co., Inc.

Tae Shin Eom

Dong Hwan Lee

Sang Jin Kim

Young Joon Lee

Yong Han Cho

Jae Hyun Kim

Eun Jung Lee

Yoon Man Lee

Su Mi Im

A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, where &#x3c3;D is a standard deviation of tablet diameters and &#x3c3;H is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.

Tablet-type epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using the same

A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.

Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same

The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.

Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same

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Suwon-si, South Korea

Tae Shin Eom