Samsung Electronics Co., Ltd.

Samsung Electro-Mechanics Co., Ltd.

Sungkyunkwan University

Kt Corporation

Crowdworks Inc.

Tae Sang Park

Seung Wook Park

Il Gyu Kim

Young Jun Moon

Soon Min Hong

Hyo Young Shin

Hyun Tae Kim

Hyeon Joon Oh

Byung Ryel In

Myung Bae Bang

Dong Hee Ahn

Seung Yeol Lee

Kwang Soo Kim

Jong Jin Park

Il Jin Kim

Young Do Kweon

Ji Min Kim

Young Kwan Kim

Min Woo Park

Woong Lin Hwang

Jin Woo Han

Sung Wook Kang

Dong Yul Lee

Gyun Heo

Deok Jin Kim

Jung Hyeon Kim

Jang Hyun Kim

Kyung Woon Jang

Hyun Joo Han

Nam Su Kim

Yong Won Lee

Su Jeong Suh

Chang Kyu Chung

Ja Myeong Koo

Se Yeong Jang

Kee Yeon Cho

Seung T Chung

Hae W Kwon

Sang Jae Yoo

Soon Jin Park

Seung Hee Oh

Sun Gu Yi

Kwang Keun Lee

Seung Kyu Lim

Nam Jung Kim

Jae Gwon Jang

Ji Young Jang

Disclosed is an automatic image classification and processing method based on the continuous processing structure of multiple artificial intelligence models. An automatic image classification and processing method based on a continuous processing structure of multiple artificial intelligence models includes receiving image data, generating a first feature extraction value by inputting the image data into a first feature extraction model among feature extraction models, generating a second feature extraction value by inputting the image data into a second feature extraction model among the feature extraction models, and determining a classification value of the image data by inputting the first and second feature extraction values into a classification model.

Automatic image classification and processing method based on continuous processing structure of multiple artificial intelligence model, and computer program stored in computer-readable recording medium to execute the same

Disclosed herein is a cleaner having an improved structure configured to improve the cleaning performance. The cleaner comprises a suction unit provided inside a body. The suction unit includes an impeller configured to suction air by rotating about a shaft, and a diffuser configured to guide air discharged from the impeller. The impeller includes a hub, and a blade disposed on the hub, and provided with a leading edge disposed in an upstream side in a direction in which air introduced into the suction unit flows, and a trailing edge disposed in a downstream side in the direction in which the air introduced into the suction unit flows. The leading edge of the blade forms an inclination of 60 degrees or more and 80 degrees or less with respect to an axial direction.

Cleaner

A motor assembly comprises a stator, a rotor configured to be rotated about a shaft by electromagnetically interacting with the stator, an impeller configured to be rotated with the rotor about the shaft by being coupled to the rotor and configured to suction air in response to a rotation, a housing configured to cover between the impeller and the stator by being coupled to the stator, a cover comprising an inlet through which air sucked by the impeller is introduced, and configured to cover the impeller, a guide member configured to guide the air discharged from the impeller and configured to be coupled to the housing, and a plurality of first vanes protruding from one of the cover and the guide member to an axial direction and coupled to the other of the cover and the guide member. The cover and the guide member are configured to be movable in the axial direction in response to not being coupled to the housing, and the cover comprises a contact portion in contact with the impeller according to a position of the cover. The contact portion is spaced apart from the impeller in response to coupling between the guide member and the housing.

Motor assembly, method of manufacturing the same and a cleaner having the same

A fingerprint recognition device includes: an integrated circuit electrically connected to at least one sensor electrode; a first circuit board located at an upper portion of the integrated circuit and provided with the at least one sensor electrode; a second circuit board electrically connected to the first circuit board and located at under the integrated circuit; a molding layer provided under the first circuit board to surround the integrated circuit so as to protect the integrated circuit from the outside; and a connection part electrically connecting the first circuit board and the second circuit board.

Fingerprint recognition device, method of manufacturing the same, and electronic device thereof

A vacuum cleaner having an improved structure capable of enhancing suction performance includes a suction unit provided in a main body, the suction unit including an impeller disposed to suck air by rotating about an axis thereof, and a diffuser disposed to guide air discharged from the impeller. The diffuser includes an inner casing, an outer casing disposed to be spaced apart from an outer circumference of the inner casing and to form a path through which the air discharged from the impeller flows, and a plurality of vanes disposed at the inner casing to guide the air discharged from the impeller to the path, and the plurality of vanes protrude toward the outer casing to cross at least a part of the path.

Vacuum cleaner

A motor includes a control part assembly having an air inlet through which air is inlet, an air flow path configured to communicate with the air inlet, and a printed circuit board; and a motor part assembly having a stator configured to generate magnetic flux when a current is applied, a rotor structured to be rotated while interacting with the stator electromagnetically, a motor shaft provided to be rotated together with the rotor, and an impeller coupled to the motor shaft and provided to be rotated to generate air flow, and is configured to be detachably coupled to the control part assembly. Through the structure as such, the performance of the motor may be improved.

Motor

Disclosed is a printed circuit board assembly PBA on which a connector for electrical connection to an external connection element is mounted. Such an assembly may be formed with a molding method of a PBA which includes applying a polymer resin to the PBA to mold the PBA in order to offer stiffness thereto. The foregoing method of molding the PBA according to the present disclosure is a molding method of a PBA including a PCB and a connector mounted on the PCB to electrically connect the same to an external connection element. The method includes combining the connector with a connector cover, applying a resin to the PBA combined with the connector cover to execute molding of the PBA, and separating the connector cover from the molded PBA to expose the electrode terminal for an external connection element.

Molding method of printed circuit board assembly

An image sensor package and image sensor chip capable of being slenderized while enhancing the reliability with respect to physical impact are provided. The image sensor package includes an image sensor chip provided with a pixel domain at a central portion of an upper surface thereof, a substrate disposed at an upper side of the image sensor chip so as to be flip-chip bonded with respect to the image sensor chip, provided with a hole formed at a position corresponding to the pixel domain, and formed of organic material, a printed circuit board at which the substrate provided with the image sensor chip bonded thereto is mounted, and a solder ball configured to electrically connect the substrate to the printed circuit board.

Image sensor package

A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, and a connection unit having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board, wherein the printed circuit board comprises a wafer printed circuit board formed with a wafer.

Printed circuit board assembly

A method of fabricating a package substrate, includes forming a cavity in at least one region of an upper surface of a wafer, the cavity including a chip mounting region, forming a through-hole penetrating through the wafer and a via filling the through-hole, forming a first wiring layer and a second wiring layer spaced apart from the first wiring layer, which are extended into the cavity, and mounting a chip in the cavity to be connected to the first wiring layer and the second wiring layer.

Method of fabricating a package substrate

Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.

Case structure having film type electronic circuit and method of manufacturing the same

Disclosed is a connection structure for a circuit board using a solder bump to arrange circuit boards. The circuit board connection structure includes a solder bump prepared on one of two circuit boards and a perforated part formed at the other of the circuit boards to receive the solder bump. Facing both circuit boards towards each other and inserting the solder bump into the perforated part, the circuit boards are desirably arranged.

Connecting structure for circuit board and connecting method using the same

Disclosed herein is a printed circuit board and a connecting method thereof. The connecting method of the circuit board assembly may include molding the printed circuit board assembly by applying a resin to the printed circuit board assembly, exposing ends of the electrode terminals of a connector mounted on a printed circuit board by partially removing the molded printed circuit board assembly, and connecting a connection member to the exposed ends of the electrode terminals of the connector. Therefore, even if the whole of the printed circuit board assembly is molded, the connection member may be freely connected to the connector of the printed circuit board assembly.

Printed circuit board assembly and connecting method thereof

An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.

IC package and method of manufacturing the same

Growing community of inventors

Seoul, South Korea

Tae Sang Park