Samsung Electronics Co., Ltd.

Samsung Display Co., Ltd.

Tae Kyu Son

Sang Don Jang

Ja Yul Kim

Sung Min Ahn

Exemplary embodiments of the invention disclose an exposure apparatus and a method of tuning parameters of a chuck, which may reduce a time taken to level the chuck by previously tuning parameters of the chuck. The method of tuning parameters of a chuck includes detecting a tilt component of the chuck, performing chuck tilt adjustment to minimize the tilt component of the chuck, and tuning the parameters of the chuck if a residual tilt component is present after performing the chuck tilt adjustment.

Apparatus and method of controlling chuck, and exposure apparatus and control method thereof

A method of determining and controlling position and attitude information associated with a 6-degree-of-freedom stage includes: receiving, from a plurality of sensors associated with the 6-degree-of-freedom stage, displacement information associated with the 6-degree-of-freedom stage. A plurality of equations associated with the plurality of sensors are determined by a control unit based on the displacement information to represent an amount of change in position and attitude associated with each measurement axis of each of the plurality of sensors. The control unit determines position information and attitude information associated with the 6-degree-of-freedom stage using the equations. Movement of the 6-degree-of-freedom stage is caused, at least in part, to be controlled based on the position information, the attitude information, or both the position information and the attitude information. Three coordinate values associated with each valid measurement point of each of the plurality of sensors are associated with at least one degree of freedom.

Ultra-precision position control device and method for determining position and attitude information associated with a 6-degree-of-freedom stage thereof

According to an example embodiment, a method to determine an exposure start position and orientation includes loading a substrate on a moving table. The substrate includes at least one alignment mark of a first set of alignment marks of a first pattern layer patterned thereon. At least one alignment mark of a second set of alignment marks of a second pattern layer is exposed on the substrate using maskless lithography. A position of the at least one alignment mark of the first set of alignment marks and a position of the at least one alignment mark of the second set of alignment marks on the substrate is measured. A relative orientation difference between a desired exposure start orientation and an obtained exposure start orientation is acquired using the measured positions of the at least one alignment mark of the first set of alignment marks and the at least one alignment mark of the second set of alignment marks. A relative position difference between a desired exposure start position and an obtained start position is acquired using the measured positions of the at least one alignment mark of the first set of alignment marks and the at least one alignment mark of the second set of alignment marks. An exposure start position and orientation compensated using the relative position difference and the relative orientation difference is determined.

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Seongnam-si, South Korea

Tae Kyu Son