Samsung Display Co., Ltd.

Samsung Electronics Co., Ltd.

Tae-Kyu Kim

Soon-Ryong Park

Hee-Seong Jeong

Woo-Suk Jung

Chul-Woo Jeong

Sung-Soo Koh

Il-Ryong Cho

Jae-Yong Kim

Eun-Ah Kim

Duk-Jin Lee

Jang Hoon Kim

Young Kuk Byun

Young-Hee An

Won-Kyu Kwak

Yoonyoung Choi

Seungjin Kim

Tae-Gon Kim

Moo-Soon Ko

Chi-Wook An

Sun-Hwa Kim

Eun-sung Kim

Seok-hwan Oh

Ok-Byoung Kim

Byung-Hyun Lee

Woo Jin Jung

Wi Jin Nam

Hyun-Sil Hong

Heesook Cheon

Soo Kyung Kim

Bo-Wo Choi

Sung-Hoon Song

Jae Yong Kim

Jong Hyun Jung

Hyun Seung Ha

Wook-Suk Jung

A method of manufacturing a semiconductor device includes forming a first lower overlay key including first and second patterns in a lower layer, forming a first upper overlay key including third and fourth patterns in an upper layer vertically disposed on the lower layer, irradiating a first measurement light to a first region of interest (ROI) over first portions of the first and second patterns to detect a first overlay error and irradiating a second measurement light to a second ROI over second portions of the first and second patterns, the second ROI being different from the first ROI, to detect a second overlay error.

Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device includes forming a mold layer on a semiconductor wafer having a plurality of integrated circuit die at least partially defined therein. An etch stopper film is selectively formed on a second portion of the mold layer extending adjacent a periphery of the semiconductor wafer, but not on a first portion of the mold layer extending opposite at least one of the plurality of integrated circuit die. A preliminary pattern layer is formed on the etch stopper film and on the first portion of the mold layer. A plurality of patterns are formed in the preliminary pattern layer by selectively exposing the preliminary pattern layer to extreme ultraviolet light (EUV). Then, hole patterns are selectively formed in the first portion of the mold layer, using the exposed preliminary pattern layer and the etch stopper film as an etching mask.

Methods of manufacturing semiconductor devices from multi-device semiconductor wafers

A method of fabricating a semiconductor device including preparing a substrate including a wafer inner region and a wafer edge region, the wafer inner region including a chip region and a scribe lane region, sequentially stacking a mold layer and a supporting layer on the substrate, forming a first mask layer on the supporting layer, the first mask layer including a first stepped region on the wafer edge region, forming a step-difference compensation pattern on the first stepped region, forming a second mask pattern including openings, on the first mask layer and the step-difference compensation pattern, and sequentially etching the first mask layer, the supporting layer, and the mold layer using the second mask pattern as an etch mask to form a plurality of holes in at least the mold layer may be provided.

Method of fabricating a semiconductor device

A method of making a display device includes forming first electrodes of organic light emitting diodes in respective pixel areas on a substrate, forming a first common layer on the first electrodes in the pixel areas, forming emission layers in the pixel areas on the first common layer, forming a second electrode of the organic light emitting diodes on the emission layer, and applying physical pressure to divide the first common layer.

Organic light emitting display

A display device is disclosed. In one aspect, the display device includes a first panel, a second panel facing the first panel, and a sealant configured to seal together the first and second panels. The first panel includes a first substrate including a display area and a peripheral area surrounding the display area, a thin film display layer formed in the display area of the first substrate, and a first lower gate driving circuit formed in the peripheral area of the first substrate. The second panel includes a second substrate including a display area and a peripheral area surrounding the display area, a contact sensing layer formed in the display area of the second panel, and a first upper gate driving circuit formed in the peripheral area of the second substrate. The sealant at least partially overlaps the first lower and upper gate driving circuits.

Display device

A sealing inspection device for detecting a bonding error at a sealing region of an upper and a lower plate in a flat panel display apparatus in which the upper and lower plates are bonded to each other by a sealing member, the sealing inspection device includes a light source configured to emit light, a polarizer configured to polarize the light emitted from the light source, the polarized light being incident on and reflected from the sealing region of the flat panel display, an optical spectrum analyzer configured to analyze the light reflected from the sealing region with respect to wavelength ranges and to determine whether a bonding error exits at the sealing region, and a beam splitter configured to change a path of the reflected light toward the optical spectrum analyzer.

Sealing inspection device and sealing inspection method of flat panel display apparatus by using the sealing inspection device

Organic light emitting display and fabricating method thereof

An optical film and an organic light emitting display apparatus including the optical film are disclosed. In one embodiment, the optical film is formed on a substrate of the organic light emitting display, and the substrate is configured to transmit light, emitted from an organic light emission unit of the display, toward the optical film. Further, the optical film is configured to absorb ambient light via a first portion, and the optical film is further configured to at least partially transmit light emitted from the organic light emission unit to the environment via a second portion.

Optical film and organic light emitting display apparatus comprising the same

An OLED display including: a substrate main body; a first transflective electrode formed on the substrate main body; an organic emission layer formed on the first transflective electrode; a second transflective electrode formed on the organic emission layer; and a dual brightness enhancement film (DBEF) disposed on a dual brightness enhancement film (DBEF) on at least one of a side of the first transflective electrode facing away from the organic emission layer, or a side of the second transflective electrode facing away from the organic emission layer.

Organic light emitting diode display

An organic light-emitting display device and a method of manufacturing the same are disclosed. The organic light-emitting display device includes: a lower substrate including a display area and a non-display area, the lower substrate further including a power supply wiring unit disposed in the non-display area, the power supply wiring unit including at least one power supply wiring extending along an edge of the display area; an encapsulation substrate having an outer surface and an inner surface facing the lower substrate; a cavity formed into the inner surface of the encapsulation substrate in a region over the power supply wiring unit such that the cavity overlaps at least part of the power supply wiring when viewed in a direction perpendicular to the outer surface of the encapsulation substrate; and a polarizing plate disposed on the outer surface of the encapsulation substrate.

Organic light-emitting display device and method of manufacturing the same

An organic light emitting diode (OLED) display according to an exemplary embodiment includes a display substrate on which a plurality of organic light emitting diodes are formed; a conducting material layer contacting one of electrodes included in the organic light emitting diode; an encapsulation substrate facing the display substrate; and an anti-reflective light transmission layer that is formed on a surface of the encapsulation substrate and is connected to the conducting material layer.

An organic light emitting display apparatus and method of manufacturing the organic light emitting display apparatus including a lower substrate having power lines in a non-display region that is outside a display region whereon an image is realized; and a functional layer formed between the power lines and an encapsulation substrate.

Organic light emitting display apparatus and method of manufacturing the same

A polarizing film having a polyvinyl alcohol-based resin film on which an iodine-first component composite particle is absorbed and oriented. A first component is included in the iodine-first component composite particle prevents iodine having high sublimation characteristics from being sublimated and prevents a molecular structure of the iodine of the iodine-first component composite particle from being destroyed.

Polarizing film, polarizing plate, method of preparing the polarizing film and organic light-emitting apparatus including the polarizing plate

An organic light emitting display device comprises: a substrate; a plurality of thin film transistors (TFTs) formed on a first surface of the substrate; a passivation layer covering the plurality of TFTs; a plurality of first pixel electrodes formed on the passivation layer and respectively electrically connected to the plurality of TFTs, and overlapping with the plurality of TFTs so as to cover the plurality of TFTs, and including a reflection layer formed of a light-reflecting conductive material; a second pixel electrode formed of a light-transmitting conductive material and disposed on the passivation layer so as to be electrically connected to the plurality of first pixel electrodes; an opposite electrode formed such that light is transmitted or reflected therethrough, and disposed opposite the plurality of first pixel electrodes and the second pixel electrode; and an organic layer interposed between the plurality of first pixel electrodes and the second pixel electrode, and including an emission layer. Accordingly, transmittivity of the organic light emitting display device is increased, and optical outcoupling efficiency of the organic light emitting display device is also increased during double-sided emission.

Organic light emitting display device

A display apparatus includes an enhanced sealing portion. The display apparatus includes a substrate unit that includes a first substrate and a second substrate facing each other; a sealing portion that is disposed between the first substrate and the second substrate; and a metal film that is disposed between the first substrate and the sealing portion. Open holes having different sizes are formed in proportion to energy intensities of an energy source applied to the metal film. During sealing in a sealing region by using a laser, since the metal film having a specific shape is patterned, even when energy having an irregular Gaussian shape is applied, uniform energy may be applied to the sealing portion. Accordingly, an adhesive force in the sealing region may be increased.

Growing community of inventors

Yongin, South Korea

Tae-Kyu Kim