Skc Solmics Co., Ltd.

Sk Enpulse Co., Ltd.

Tae Kyoung Kwon

Jang Won Seo

Sunghoon Yun

Jong Wook Yun

Hye Young Heo

Jaein Ahn

Jung Nam Lee

Joonsung Ryou

Disclosed is a method for producing a polishing pad, the method comprising the steps of: providing a polishing layer; forming a first through-hole penetrating the polishing layer; providing a support layer facing the polishing layer; interposing an adhesive layer between the polishing layer, which has the first through-hole, and support layer, and adhering the polishing layer and support layer to each other by means of the adhesive layer; forming, with the first through-hole as a reference point, a third through-hole penetrating the adhesive layer on a set area thereof, and a second through-hole penetrating the support layer on a set area thereof; and inserting a window inside the first through-hole.

Polishing pad and method for producing same

A classifying and purifying apparatus of a solid blowing agent includes a classifier which classifies a supplied solid blowing agent into first microspheres and second microspheres, a storage connected to the classifier, in which the classified first microspheres flow in to be stored and emitted, and a filter arranged on the moving route of the solid blowing agent or the first microspheres which separates metallic substance from the object of filtering comprising the solid blowing agent or the first microspheres.

Classifying and purifying apparatus of solid blowing agents and methods of classifying and purifying solid blowing agents

Embodiments relate to a leakage-proof polishing pad for use in a chemical mechanical planarization (CMP) process and a process for producing the same.

Leakage-proof polishing pad and process for preparing the same

Growing community of inventors

Ulsan, South Korea

Tae Kyoung Kwon