University of California

Tae Kyoung Kim

Sungho Jin

Zhaowei Liu

Renkun Chen

Chulmin Choi

Jaeyun Moon

Bryan Van Saders

Young Oh

Dae-Hoon Hong

Techniques, systems, devices and materials are disclosed for spectrally selective coatings for optical surfaces having high solar absorptivity, low infrared emissivity, and strong durability at elevated temperatures. In one aspect, a spectrally selective coating includes a substrate formed of a light absorbing material, and a composite material formed over the substrate and including nanoparticles dispersed in a dielectric material, in which the composite material forms a coating capable of absorbing solar energy in a selected spectrum and reflecting the solar energy in another selected spectrum.

Spectrally selective coatings for optical surfaces

Methods, systems, and devices are disclosed for fabricating and implementing optically absorbing coatings. In one aspect, an optically selective coating includes a substrate formed of a solar energy absorbing material, and a nanostructure material formed over the substrate as a coating capable of absorbing solar energy in a selected spectrum and reflecting the solar energy in another selected spectrum. A concentrating solar power (CSP) system includes heat transfer fluids (HTFs); thermal energy storage system (TES); and solar receivers in communication with HTFs and including a light absorbing coating layer based on cobalt oxide nanoparticles.

Solar energy absorbing coatings and methods of fabrication

Methods, systems, and devices are described for slicing and shaping materials using magnetically guided chemical etching. In one aspect, a method includes forming a pattern on a substrate by a mask, depositing a catalytic etcher layer on the patterned substrate, a magnetic guide layer on the etcher layer, and a protection layer on the guide layer, etching the substrate by applying an etching solution to the substrate that chemically reacts with the etcher layer and etches material from the substrate at exposed regions not covered by the mask, steering the composite etching structure into the substrate during the etching by an applied magnetic field that creates a force on the guide layer to direct the etching, in which the steering defines the shape of the sliced regions of the etched substrate, and removing the etched material, the mask, and the composite etching structure to produce a sliced material structure.

Semiconductor processing by magnetic field guided etching

Growing community of inventors

La Jolla, CA, United States of America

Tae Kyoung Kim