Samsung Electro-mechanics Co., Ltd.

Tae-Kyoung Kim

Dong-Jin Park

Chang-Sup Ryu

Jee-Soo Mok

Yoong Oh

Youn-Soo Seo

Byung-Bae Seo

Eung-Suek Lee

Hee-Bum Shin

Ho-Gyu Yoon

Jin-Cheol Kim

A dielectric body and a method of producing the dielectric body are disclosed. In accordance with an embodiment of the present invention, the dielectric body using a polymer matrix and being expressed in the following Reaction Scheme 1 includes two or more kinds of ceramic fillers having different x values in the following Reaction Scheme 1. In this way, a dielectric body having a stable dielectric constant as well as a high dielectric constant against the change in temperature can be manufactured.BaSrTiO&#x2003;&#x2003;[Reaction Scheme 1]

Dielectric body and method for production thereof

A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

Printed circuit board using paste bump and manufacturing method thereof

Growing community of inventors

Suwon-si, South Korea

Tae-Kyoung Kim