Samsung Electronics Co., Ltd.

Tae-koo Lee

Joong-Hyun Baek

Yun-hyeok Im

Min-ha Kim

Jin-yang Lee

A stacked semiconductor module includes a lower chip scale package (CSP) mounted on a module board, and an inverted upper CSP attached to the top of lower CSP to form a stacked semiconductor package. The lower and upper CSPs are electrically connected to each other outside of the stacked semiconductor package. This electrical connection may be made using the module board. Further, a conductive interconnection tape may be used to electrically connect the upper CSP to regions on the module board, which are electrically connected to the region at which the lower CSP is electrically connected to the module board.

Stacked semiconductor module and method of manufacturing the same

A multi-chip package (MCP) in which heat generated in first and second chips of the MCP is spread effectively and a method for manufacturing the same. The MCP includes first and second chips. The MCP further comprises a tape including a conductive material layer therein situated between the first chip and the second chip. Thus, the heat generated in the second chip can effectively spread to the outside through the tape.

Growing community of inventors

Kyungki-do, South Korea

Tae-koo Lee