Samsung Display Co., Ltd.

Samsung Electronics Co., Ltd.

Purdue Research Foundation

Tae-Joon Kim

Sang-Hee Lee

Yang-Wan Kim

Hyun-Wook Cho

Ki-Il Kim

Jun-Young Ko

David James Love

Mu-Kyung Jeon

Tae-Eun Kim

Duck-Dong Hwang

Min-Kyu Woo

Sang-Kook Kim

Jin-Young Jeon

Seung-Mock Ro

Clerckx Bruno

Ki-Hwan Park

Young-Choul Kook

A touch sensing display device including a first substrate with a display unit, a second substrate disposed on the first substrate, a window cover disposed on the second substrate, and a touch force sensor. The touch force sensor includes a first electrode disposed between the first substrate and the second substrate or on a bottom surface of the first substrate, and a second electrode disposed under the first substrate.

Touch sensing display device

According to exemplary embodiments of the present disclosure, a capacitor may be connected to a gate electrode of a transistor. The capacitor includes a first gate electrode connected to the gate electrode of the transistor, a gate insulation layer formed on the first gate electrode, and an upper electrode formed on the gate insulation layer. The upper electrode is formed to cover a region where the first gate electrode and the upper electrode are overlapped. The capacitor is applicable to at least one of a light emitting driving circuit and a scan driving circuit, and at least one of the light emitting driving circuit and the scan driving circuit may be included in a display device.

Capacitor, driving circuit comprising the capacitor, and display device comprising the driving circuit

An apparatus and a method for opportunistic user scheduling of two-cell multiple user Multiple Input Multiple Output (MIMO) by a base station, the method comprising: broadcasting signals through random beams to users; and receiving Channel Quality Information (CQI) from best K user set. The CQI is calculated based on all possible combinations of transmit beamforming vectors.

Method and apparatus for opportunistic user scheduling of two-cell multiple user MIMO

An organic light emitting diode (OLED) display includes: a substrate; a scan line formed on the substrate and that transfers a scan signal; a data line and a driving voltage line that intersect the scan line and that transfer a data signal and a driving voltage, respectively; a switching thin film transistor (TFT) connected to the scan line and the data line; a driving TFT connected to the switching TFT and the driving voltage line; an OLED connected to the driving TFT; a storage capacitor connected between the driving voltage line and a driving gate electrode of the driving TFT; and a boosting capacitor connected to the storage capacitor, wherein the storage capacitor has at least one capacitor opening.

Organic light emitting diode display

An organic light-emitting display apparatus includes: a substrate; a display part on the substrate and configured to display an image, the display part including a thin-film transistor (TFT) and an organic light-emitting diode (OLED); and a pad electrode on the substrate and outside the display part, and the pad electrode includes an embossed-shaped conductive reflective layer.

Organic light-emitting display apparatus and method of manufacturing the same

An organic light-emitting display apparatus including a switching thin film transistor (TFT) on a substrate, wherein the switching TFT is electrically coupled to a scan line and a data line, a driving TFT electrically coupled to the switching TFT, the driving TFT including a driving semiconductor layer, and an organic light-emitting diode (OLED) electrically coupled to the driving TFT, wherein the driving semiconductor layer includes a first region bending from a first direction to a second direction that intersects with the first direction a second region bending from the second direction to the first direction, and a third region coupling the first region to the second region, the third region making an obtuse angle with each of the first region and the second region.

Organic light-emitting display apparatus and photo mask for manufacturing same

A light emitting diode package module includes a printed circuit board, a wiring film and light emitting diode packages. The printed circuit board includes first regions and second regions, which are alternately disposed. The wiring film is disposed over the printed circuit board and includes first sections and second sections, which are alternately disposed. Each diode package is disposed between one of the first regions and one of the first sections. The light emitting diode package is electrically connected to the wiring film. The second sections and the second regions are adhered to each other so that the wiring film and the printed circuit board are electrically connected.

Light emitting device with light emitting diodes fixed to printed circuit

A liquid crystal display is disclosed. In one embodiment, the display includes i) a liquid crystal display panel configured to display images, ii) a backlight unit configured to provide light to the liquid crystal display panel and iii) a mold frame comprising a frame main body and a plurality of first side walls, wherein the frame main body is configured to receive the backlight unit, and wherein the first side walls are formed on a top surface of the frame main body. The display may further include a bottom chassis comprising a bottom plate and a plurality of second side walls, wherein the bottom plate is configured to support the mold frame and wherein the second side walls are formed at edges of the bottom plate. The first and second side walls surround side surfaces of the liquid crystal display panel while not contacting the side surfaces, and the first and second side walls are alternately disposed along a circumferential direction of the liquid crystal display panel.

Liquid crystal display

A receiving module of a liquid crystal display panel includes a mold frame and a bottom chassis. The mold frame forms an internal space that receives a backlight unit. The bottom chassis includes a bottom portion facing a rear side of the mold frame and includes side walls connected with the bottom portion and facing an outer side of the mold frame. At least one of the side walls includes a fastening protrusion in at least one side thereof, and the mold frame includes a groove portion that receives, at an outer side thereof, the at least one side wall including the fastening protrusion such that the mold frame is coupled to an inner side of the side wall and the fastening protrusion.

Receiving module, manufacturing method of the same, and liquid crystal display with the same

A flexible printed circuit board includes a base film made of an insulating material, a power application wiring disposed on a first surface of the base film, a bypass wiring disposed on a second surface, opposite the first surface, of the base film, a first connection wiring which electrically connects the power application wiring to the bypass wiring, a second connection wiring spaced apart from the first connection wiring and which electrically connects the power application wiring to the bypass wiring, and a first cover film disposed on the first surface of the base film to cover at least a first portion of the second connection wiring. At least a first portion of the first connection wiring is exposed through the first cover film.

Flexible printed circuit board and liquid crystal display device including the same

A method of and system for cleaning semiconductor wafers minimizes the exposure of the wafers to the air by washing, rinsing and drying the wafers in one cleaning chamber. The system includes a wafer support by which a plurality of wafers can be supported in the cleaning chamber as oriented vertically and spaced from each other, and tubular de-ionized water supply nozzles extending longitudinally in the direction in which the wafers are spaced from each other as disposed to the sides of the wafers. Each de-ionized water supply nozzle has an inner nozzle passageway, and a plurality of sets of nozzle holes extending radially through the main body of the nozzle from the inner nozzle passageway. Each such set of nozzle holes subtends an angle of 80&#x2dc;100&#xb0; in a vertical plane and is directed towards a surface of a respective wafer W. During a primary rinse procedure, the de-ionized water is supplied to the de-ionized water spray nozzles, and the liquid in the cleaning chamber is simultaneously discharged from a lower part of the chamber and by being allowed to overflow the chamber. The supplying of the de-ionized water to the de-ionized water spray nozzles and the discharging of the cleaning chamber are carried out in proportions that minimize differences in the etching rate of a wafer across the surface thereof.

Method of and apparatus for cleaning semiconductor wafers

The liquid crystal display device includes a back light assembly (), a receiving container () and a liquid crystal display panel (). The back light assembly () generates a first light to transform the first light into a second light having modulated optical characteristics. The receiving container () has sidewalls () and a bottom face (). The bottom face () includes a combination groove () for fixing the liquid crystal display device to an external member. A width of a portion of the combination groove () is larger than a width of an entrance of the combination groove (). The liquid crystal display panel transforms the second light into an image light. The receiving container () receives the liquid crystal display panel.

Liquid crystal display device and display apparatus having the same including rear case and receiving container attachment combination

Disclosed is a liquid crystal display device capable of preventing a grounding clip, which is combined to an end of a mold frame to ground a printed circuit board to a top chassis, from making electrical contact with a display unit. A guide projection is formed at the end of the mold frame so as to be placed adjacent to the grounding clip. A gap between the guide projection and the liquid crystal display panel is narrower than a gap between the liquid crystal display panel and the grounding clip. Accordingly, even though the mold frame is bent by means of an outerforce applied to both ends of the mold frame, it is possible to prevent the grounding clip from deforming and making electrical contact with the liquid crystal display panel.

Growing community of inventors

Yongin, South Korea

Tae-Joon Kim