Magnachip Semiconductor, Inc.

Tae Jong Lee

Kang Sup Shin

Yang Beom Kang

Jong Yeul Jeong

Kwan Soo Kim

Si Bum Kim

A metal wiring for applying a voltage to a semiconductor component of a semiconductor device, the semiconductor device comprising a low voltage applying region adjacent to a high voltage applying region, is provide. The metal wiring includes: an isolator region, a first lower metal layer electrically connected to the semiconductor component, a first upper metal layer configured to be electrically connected to an external power supply, and a plurality of inter-metal dielectric layers deposited between the first lower metal layer and the first upper metal layer, each of the plurality of inter-metal dielectric layers comprising at least one contact plug for providing an electrical connection between the first lower metal layer and the first upper metal layer.

Growing community of inventors

Cheongju-si, South Korea

Tae Jong Lee