Samsung Electronics Co., Ltd.

Tae-Jin Yun

Byung-Suk Park

Young-Hak Lee

Mun-Hee Lee

Won-Soo Choi

Dong-Pyo Hong

Provided is a method of forming reference information for defining a fault pattern of equipment, and monitoring equipment. One example embodiment method may include performing an angle spectrum analysis by re-classifying fault points distributed on a plane, the plane including a first component axis and a second component axis, and the re-classifying fault points including calculating an angle for each of the fault points with reference to any one of the first component axis and the second component axis of the plane, and forming a reference fault pattern for defining a fault pattern of the re-classified fault points.

Method of defining fault pattern of equipment and method of monitoring equipment using the same

An apparatus for polish-grinding a semiconductor wafer which assuredly removes contaminant dusts from the polished wafer includes a grinding device for polishing a surface of the wafer. The grinding device has a chuck table on which the wafer is laid, a grinding wheel for grindingly polishing the wafer, and means for supplying water to the wafer. The means for supplying water provides water to region of contact between the grinding wheel and the wafer. The apparatus also includes a cleaning device for cleaning any remaining dust on the wafer, having a spin chuck table for rotating the polished wafer, means for supplying a detergent to the polished wafer. The means for supplying the detergent injects the detergent on the surfaces of the polished wafer. The apparatus also includes a controller for controlling the grinding device and the cleaning device. Accordingly, the apparatus according to the present invention can prevent dust from being suctioned to the front side of a wafer, and can remove dust during and after a wafer-grinding process.

Growing community of inventors

Suwon-si, South Korea

Tae-Jin Yun