Samsung Electronics Co., Ltd.

Tae-je Cho

Kyung-Lae Jang

Un-Byoung Kang

Yong-Hwan Kwon

Hee-Seok Lee

Heung-Kyu Kwon

Chung-Sun Lee

Hyung-Sun Jang

Woon-Seong Kwon

Yun-hyeok Im

Cha-jea Jo

Ki-Won Choi

A semiconductor package includes a package base substrate, at least one first semiconductor chip disposed on the package base substrate, and at least one stacked semiconductor chip structure disposed on the package base substrate adjacent to the at least one first semiconductor chip. The at least one stacked semiconductor chip includes a plurality of second semiconductor chips. A penetrating electrode region including a plurality of penetrating electrodes is disposed adjacent to an edge of the at least one stacked semiconductor chip structure.

Semiconductor package having stacked semiconductor chips

Provided are camera modules capable of effectively shielding electromagnetic (EM) waves and methods of fabricating the same. A method of fabricating a camera module includes, preparing a first wafer including an array of lens units. Then, a second wafer including an array of image sensor CSPs (chip-scale packages) is prepared. Each of the image sensor CSPs includes an image sensor chip corresponding to one of the lens units. The first wafer is stacked on the second wafer. The first wafer and the second wafer are cut to form a trench exposing the top surface of the image sensor chip at the interface between adjacent lens units. The trench is filled with a first material used for forming a housing. The first material and the image sensor chip are cut at the interface between the adjacent lens units.

Camera modules and methods of fabricating the same

A printed circuit board for a high-speed semiconductor package uses bonding wires as a shield structure, e.g., to shield an open portion of signal transmission lines, and thereby reduce the likelihood of coupling noises, e.g., between signal transmission lines.

Printed circuit board having a bond wire shield structure for a signal transmission line

Provided is a semiconductor device package in which instability of a bonding wire that may occur when a plurality of semiconductor chips are stacked is prevented and which obtains a light, thin and small structure. The semiconductor device package includes a substrate having a plurality of substrate pads on a top surface of the semiconductor device package and includes a plurality of semiconductor chips stacked on the substrate. Each of the semiconductor chips have a chip pad electrically connected to a common pin, e.g., to which a common signal may be concurrently applied to each of the semiconductor chips. An interposer chip, also stacked on the substrate, has a connecting wire electrically connected to the chip pad, the common pin of each of the semiconductor chips being thereby electrically coupled at the connecting wire via the chip pad, and the connecting wire being thereby electrically connected to the substrate pad.

Semiconductor device package

Growing community of inventors

Gyeonggi-do, South Korea

Tae-je Cho