Samsung Electronics Co., Ltd.

Sungkyunkwan University

University of Illinois

Washington University

Snu Rdb Foundation

Global Frontier Center-multiscale Energy Systems

Tae-il Kim

John A Rogers

Jae-Hoon Kim

Soo-Hyung Kim

Man Soo Choi

Hyung-ock Kim

Jong-Kui Park

Dae-Chul Kang

Hyu-Myung Jeon

Kahp-Yang Suh

Michael Raymond Bruchas

Robert Gereau

Jaewoong Jeong

Jordan Gary McCall

Sungmin Bae

Gunchul Shin

Yong Whan Choi

Jung-yun Choi

Daniel Brenner

Chanho Jeong

Daeshik Kang

Chanseok Lee

A pressure sensor includes a substrate, a patterned circuit, and a conductive material layer. The patterned circuit, formed on the substrate, includes a first-path part and a second-path part of which at least a part is formed at a predetermined gap from at least a part of the first-path part. The conductive material layer, resiliently disposed on the patterned circuit, has protrusions. The conductive material layer deforms to determine a contact area between the protrusions and the substrate, and upon deformation of the conductive material layer to contact the first-path part, the gap between the first-path part and the second-path part, and the second-path part, the first-path part electrically connects to the second-path part.

Multi-type pressure sensor

Computer implemented methods of designing integrated circuits and computing systems are provided. A computer implemented method of designing an integrated circuit according to the inventive concepts may be performed by a processor and may include performing a placement and routing (P&R) operation for standard cells defining the integrated circuit, extracting characteristic values from a result of the P&R operation, generating a physical-aware annotation file by determining a plurality of representative characteristic values that respectively correspond to a plurality of groups based on the extracted characteristic values, and performing a physical-aware synthesis operation to generate a netlist from input data for the integrated circuit, based on the generated physical-aware annotation file.

Computer implemented methods and computing systems for designing integrated circuits by considering back-end-of-line

Provided are implantable or surface mounted biomedical devices and related methods for interfacing with a target tissue. The devices have a substrate and device component supported by the substrate. The components of the device are specially configured and packaged to be ultra-thin and mechanically compliant. In particular, device thicknesses are less than 1 mm and have lateral dimensions between about 1 m and 10 mm, depending on the application. Delivery substrates may be incorporated to assist with device implantation and handling. The devices can be shaped to provide injection in a minimally invasive manner, thereby avoiding unnecessary tissue damage and providing a platform for long-term implantation for interfacing with biological tissue.

Injectable and implantable cellular-scale electronic devices

A high-sensitivity sensor containing cracks is provided. The high-sensitivity sensor is obtained by forming microcracks on a conductive thin film, which is formed on top of a support, wherein the microcracks form a micro joining structure in which the microcracks are electrically changed, short-circuited or open, thereby converting external stimuli into electric signals by generating a change in a resistance value. The high-sensitivity sensor can be useful in a displacement sensor, a pressure sensor, a vibration sensor, artificial skin, a voice recognition system, and the like.

High-sensitivity sensor comprising conductive thin film containing cracks and method for manufacturing same

A semiconductor device can be manufactured based on patterning groups to include a metal layer patterned according to separate patterning groups. The patterning groups are based on a layout pattern. Preparing the layout pattern includes selecting a first power pattern and a second power pattern, selecting a first pattern and a second pattern therebetween, and selecting a tie-connection pattern to connect the first power pattern to the first pattern. The manufacturing includes forming metal lines according to the patterning groups. Photomasks are manufactured according to the layout pattern, and the metal lines are formed according to the photomasks. A first photomask is manufactured based on the first power pattern and the second power pattern, the first pattern, and the tie-connection pattern, and a second photomask is manufactured based on the second pattern.

Method of fabricating semiconductor device

An electronic device according to one embodiment of the present disclosure may include a plurality of antennas for transmitting and receiving radio waves, at least one sensor for sensing a physical quantity or physical changes, a sensor hub for outputting a control signal in response to an output from the at least one sensor, and a communication module for controlling wireless communication using the plurality of antennas in response to the control signal. Various other exemplary embodiments are possible.

User device and operating method therefor

Growing community of inventors

Gyeonggi-do, South Korea

Tae-il Kim