Samsung Electronics Co., Ltd.

Tae-hyoung Koo

Dongjun Lee

Yongsun Ko

Sam-jong Choi

Sue-ryeon Kim

Jong-soo Kim

Ji-Won You

Cheong-jun Kim

Samjong Choi

Hyun-hee Ju

A semiconductor wafer including a main body including first and second surfaces opposite each other, a notch including a recess on an outer periphery, a first bevel region formed along the outer periphery of the main body, including a first slope connecting the first and second surfaces and having a first height with respect to a straight line extending from a first point where the first surface and the first slope meet to a second point where the second surface and the first slope meet, and a second bevel region in contact with the recess or opening, including a second slope connecting the first and second surfaces and having a second height, different from the first height, with respect to a straight line extending from a third point where the first surface and the second slope meet to a fourth point where the second surface and the second slope meet.

Semiconductor wafer, semiconductor structure and method of manufacturing the semiconductor wafer

A wafer can be provided to include a single crystalline semiconductor material with a predetermined crystal orientation. The wafer can include a laser mark at a determined position on a front surface or on a back surface of the wafer, where the determined position is configured to indicate the predetermined crystal orientation of the single crystalline semiconductor material.

Semiconductor wafers including indications of crystal orientation and methods of forming the same

Growing community of inventors

Hwaseong-si, South Korea

Tae-hyoung Koo