Samsung Electronics Co., Ltd.

Tae-hyeong Kim

Tae-Je Cho

Sun-kyoung Seo

Ji-hwang Kim

Yeong-Kwon Ko

Young-chul Lee

Myeong-hwa Kim

Jeong-gen Yoon

Yeon-kwan Moon

Ja-myeong Koo

Seung-yup Lee

Hwa-jun Doo

Min-goo Seo

An electronic device comprising a metal case having a metal pad attached thereto is disclosed. According to the present invention, the electronic device comprises: a metal case having a metal terminal part formed therein; a metal pad joined to the metal terminal part by laser welding; and a conductive first coating layer coated on one surface of the metal pad, wherein the light reflectivity of the first coating layer is lower than the light reflectivity of the metal pad.

Electronic device comprising metal case having metal pad attached thereto

A display apparatus includes: a signal receiver configured to receive a video signal from an external first display apparatus; a signal processor configured to process the video signal received in the signal receiver; a display configured to display an image based on the video signal processed by the signal processor; and a controller configured to control the signal processor so that the display does not display an image based on a first frame of the video signal including a first on-screen-display (OSD) menu generated by the first display apparatus and to display an image based on a second frame of the video signal excluding the first OSD menu.

Display apparatus and recording medium

Semiconductor devices and methods for manufacturing a semiconductor device include a first semiconductor substrate in which a first scribe line region and a first chip region are defined, a first alignment mark inside the first semiconductor substrate and in the first scribe line region so as to be spaced apart from an upper side of the first semiconductor substrate, a second semiconductor substrate on the first semiconductor substrate and in which a second scribe line region and a second chip region are defined, and a second alignment mark inside the second semiconductor substrate and in the second scribe line region so as to be spaced apart from an upper side of the second semiconductor substrate, wherein the second semiconductor substrate is on the first semiconductor substrate so that positions of the first alignment mark and the second alignment mark correspond to each other.

Alignment mark for semiconductor device

A semiconductor device, a semiconductor package, and a package stack structure include a semiconductor substrate, a first bonding pad disposed on a first surface of the semiconductor substrate, and a first pillar disposed on the first bonding pad. An upper surface of the first pillar has a concave shape. Side surfaces of the first pillar are substantially planar.

Semiconductor devices and package substrates having pillars and semiconductor packages and package stack structures having the same

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Suwon-si, South Korea

Tae-hyeong Kim