Samsung Electronics Co., Ltd.

Ulsan National Institute of Science and Technology

Tae Hyeong Kim

In Sik Cho

Marc Madou

Hee Kook Choi

Yoon-Kyoung Cho

Kameel Abi-Samra

Hwa Young Lee

Tae Sung Park

Sang Hyeop Lee

Hee Sun Rho

Choong H Han

Gi Su Yoo

Bo K Shim

A microfluidic device, a microfluidic system and a method for controlling a microfluidic test device are provided. The microfluidic device includes a rotatable platform including a sample chamber to which a sample is supplied, a first reagent chamber; a first capture conjugate disposed in the first reagent chamber and configured to capture a target material contained in the sample; a second reagent chamber; a signal material disposed in the second reagent chamber and configured to be electrochemically induced by the first capture conjugate; a reaction chamber providing an area in which a biochemical reaction between the sample and the signal material supplied occurs when the platform rotates; a second capture material disposed in the reaction chamber and configured to capture the target material; a detection chamber separated from the reaction chamber, the detection chamber comprising a detector configured to detect an electrochemical signal generated by the signal material; and a plurality of channels connecting the chambers.

Microfluidic device, microfluidic system and method for controlling microfluidic test device

A semiconductor device package is equipped with devices for preventing the formulation of air traps in its encapsulated package body. These devices include dummy block leads formed on the outermost inner lead of each row of inner leads, and extended portions formed on each tie bar. Each dummy block lead extends from the end of an outermost inner lead and is integrally formed therewith. The tie bar extended portions are separated into several parts defined by spaces between the parts, and the several parts are formed integral with each other and with the tie bar. The dummy block leads and the tie bar extended portions may be formed so as to be inclined relative to horizontal and with jagged edges at their side surfaces. The dummy block leads and tie bar extended portions serve to reduce the velocity of the potting resin which forms the encapsulate, as it enters the die cavity for encapsulation, but before the resin actually contacts the chip or the inner leads. Thereby, the flow velocity at various points within the mold cavity is uniform, and formation of air traps is prevented.

Semiconductor device packages having dummy block leads and tie bars with

A semiconductor device package includes a semiconductor chip and a plurality of inner leads, each having at least one slot formed along an upper surface of the inner lead. An adhesive layer is used to attach a bottom surface of the semiconductor chip to the upper surface of the inner lead. An encapsulant is allowed to flow in a package body mold, around the inner leads and through the slot. The slots prevent the production of turbulence along a side surface of the inner lead opposite to the flow direction, thereby avoiding problems associated with incomplete encapsulation such as the internal voids.

Semiconductor device package having inner leads with slots

Disclosed herein is a rack for carrying a plurality of lead frames during processes for plating lead frames,

Apparatus for automatic loading/unloading of rack carrying lead frame

Growing community of inventors

Cheonan, South Korea

Tae Hyeong Kim