Samsung Electro-mechanics Co., Ltd.

Tae Hyeok Kim

Sang Soo Park

Young Ghyu Ahn

Min Cheol Park

Byoung Hwa Lee

Heung Kil Park

Hwi Dae Kim

Young Jun Cha

Yeon Ho Choi

Ji Hong Jo

Sung Woo Kim

Jae Yeol Choi

Woo Chul Shin

Chan Young Yoon

Jin Sung Kim

Jin Man Jung

Hye Yeon Cha

Seok Kyoon Woo

Jang Ho Park

Chang Sup Ryu

Eun Sang Na

Jea Yeol Choi

Hye Seong Kim

Sam Jin Her

Ok Nam Kim

Jong Yeol Jeon

A multilayer ceramic electronic component includes a ceramic body comprising dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween. The first internal electrode comprises a body portion contributing to the capacitance generation and a lead-out portion having a narrower width than the body portion and an end exposed from a surface, and the second internal electrode comprises a body portion contributing to the capacitance generation and a lead-out portion having a narrower width than the body portion and an end exposed from another surface. A ratio (w2/w1) of a width (w2) of the lead-out portion of the first and second internal electrodes to a width (w1) of the body portion satisfies 0.3&#x2264;w2/w1&#x2264;0.5.

Multilayer ceramic electronic component

A multilayer ceramic electronic component includes: a ceramic body including an active layer, in which first and second internal electrodes are disposed with a dielectric layer interposed therebetween, the N number of each of the first and second internal electrodes being stacked to be alternately exposed from first and second external surfaces; and first and second external electrodes disposed on the first and second external surfaces of the ceramic body and connected to the first and second internal electrodes, respectively. The ceramic body further includes a cover layer disposed above or below the active layer. The cover layer includes a plurality of first and second dummy electrodes. A number (A&#x3e;N) of the first and second dummy electrodes are stacked to be alternately exposed from the first and second external surfaces.

Multilayer ceramic electronic component having dummy electrodes in cover layer of body thereof

A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes stacked to be alternately exposed to first and second outer surfaces with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body to be electrically connected to the first and second internal electrodes, respectively. The ceramic body further includes a protective layer disposed on at least one of upper and lower portions of the first and second internal electrodes, the protective layer includes a plurality of dummy electrode cells each having the plurality of dummy electrodes stacked thereon, and a thickness from the uppermost dummy electrode to the lowermost dummy electrode of each of the plurality of dummy electrode cells is greater than a length of each of the plurality of dummy electrode cells.

A multilayer capacitor includes a connecting electrode provided on a surface opposite to a surface on which the capacitor body is mounted, and a third external electrode and a fourth external electrode extend to cover opposing ends of the connecting electrode across a width of the capacitor body. The third and fourth external electrodes are disposed on respective side surfaces of the capacitor body opposite each other across the width, and contact respective first and second pluralities of internal electrodes disposed in the capacitor body.

Multilayer capacitor

A multilayer ceramic electronic component includes: a body having first to sixth surfaces, and including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed and exposed through the third and fourth surfaces, respectively; and first and second external electrodes disposed on the third and fourth surfaces of the body, respectively, and including first and second connected portions connected to the first and second internal electrodes, respectively, and first and second band portions extending from the first and second connected portions to portions of at least one of the first and second surfaces of the body, respectively. The external electrodes include conductive layers and plating layers, respectively, and surfaces of end portions of external electrodes are flat.

Multilayer ceramic electronic component, method of manufacturing the same, and print circuit board having the same embedded therein

An embedded device includes a multilayer body including dielectric layers and internal electrode layers interposed between adjacent dielectric layers; external electrodes disposed on external surfaces of the multilayer body to apply electric charges having different polarities to adjacent internal electrode layers, the external electrodes containing a conductive material; first copper layers disposed on external surfaces of the external electrodes to cover the external electrodes; and second copper layers disposed on the first copper layers to cover the first copper layers. An average particle diameter of powder particles of the first copper layers is greater than an average particle diameter of powder particles of the second copper layers.

Embedded device, and printed circuit board having the same

There is provided a multilayered ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are stacked; an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, to form capacitance; an upper cover layer formed above the active layer, a lower cover layer formed below the active layer and being thicker than the upper cover layer; and first and second external electrodes formed to cover both end surfaces of the ceramic body, wherein a ratio of an area Y of a region overlapped between the first and second internal electrodes to a total area X of the active layer and the upper cover layer on a cross section of the ceramic body in length-thickness (L-T) directions is in a range of 0.5 to 0.9.

Multilayered ceramic capacitor and board for mounting the same

A multilayer ceramic capacitor may include: a ceramic body in which dielectric layers having an average thickness of 0.2 &#x3bc;m to 2.0 &#x3bc;m are stacked; an active layer configured to form capacitance by including first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having at least one of the dielectric layers interposed therebetween; an upper cover layer formed on the active layer; a lower cover layer formed below the active layer and being thicker than the upper cover layer; and first and second external electrodes covering the end surfaces of the ceramic body. At least one edge of the ceramic body in length, width, and thickness directions may be rounded. When a radius of curvature of the edge is defined as R and a thickness of the upper cover layer is defined as D, R/D may be in a range of 0.1 to 0.7.

Multilayer ceramic capacitor and board having the same mounted thereon

There is provided a multilayer ceramic capacitor including: a ceramic body; an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body, disposed vertically on upper and lower surfaces of the ceramic body and forming capacitance; an upper cover layer formed upwardly of the active layer; a lower cover layer formed downwardly of the active layer and having a thickness greater than that of the upper cover layer; and first and second external electrodes covering both end surfaces of the ceramic body, wherein the active layer includes a first block in which a first region I and a second region II formed, and a second block in which a third region III, and a fourth region IV formed.

Multilayer ceramic capacitor and board for mounting the same

A multilater ceramic capacitor includes: a ceramic body in which a plurality of dielectric layers are laminated; and an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween, and forming capacitance. An upper cover layer is formed on an upper portion of the active layer; a lower cover layer is formed on a lower portion of the active layer and having a thickness greater than that of the upper cover layer. First and second external electrodes cover both end surfaces of the ceramic body. Specific sizing of ceramic body and electrodes is defined.

Multilayer ceramic capacitor and circuit board for mounting the same

There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are laminated; a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes covering both end surfaces of the ceramic body, wherein the ceramic body includes an active layer forming capacitance by including the plurality of first and second internal electrodes and a cover layer formed on an upper portion or a lower portion of the active layer, wherein the active layer includes a first block in which a first region I, and a second region II, and a second block in which a third region III, and a fourth region IV.

There is provided a multilayered ceramic capacitor, including: a ceramic body having a plurality of dielectric layers laminated therein; an active layer including a plurality of internal electrodes having the respective dielectric layers interposed therebetween; an upper cover layer; a lower cover layer; external electrodes; and a plurality of dummy electrodes, wherein, when A is defined as &#xbd; of an overall thickness of the ceramic body, B is defined as the thickness of the lower cover layer, C is defined as &#xbd; of an overall thickness of the active layer, and D is defined as the thickness of the upper cover layer, a ratio of deviation between a center portion of the active layer and a center portion of the ceramic body, (B+C)/A, satisfies 1.063&#x2266;(B+C)/A&#x2266;1.745.

Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor thereon, and packing unit for multilayered ceramic capacitor

There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer, the lower cover layer being thicker than the upper cover layer; a dummy electrode formed inside at least one of the upper and lower cover layers; and first and second external electrodes, wherein, when A is defined as &#xbd; of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as &#xbd; of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063&#x2266;(B+C)/A&#x2266;1.745.

Multilayered ceramic capacitor, mounting structure of circuit board having multilayered ceramic capacitor mounted thereon, and packing unit for multilayered ceramic capacitor

Through holes for flow paths of the fuel cell are formed in a thermoplastic polymer film by a process selected from a group consisting of laser drilling, etching and lithography, an inner side surface of the thermoplastic polymer film is coated with a metal layer, and the through holes are filled with a fuel diffusion material and a catalyst to provide an anode. The procedure is repeated to provide a cathode. Then, the anode and the cathode are placed to oppose each other. A cation conducting polymer membrane is disposed, between the anode and the cathode, and the anode, the cation conducting polymer membrane and the cathode are hot-pressed.

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Gyunggi-do, South Korea

Tae Hyeok Kim