Skhynix Inc.

Egtm Co., Ltd.

Tae Hwan Lim

Sang Hyun Lee

Tae Young Lee

Dong Kyun Lee

Sun Young Baik

Sung Jun Ji

Shin Beom Kim

Jung Bum Woo

Soo Hyuk Kim

Byeong Ho Lee

Su Pill Chun

Jang Keun Sim

A semiconductor fabricating apparatus may include a collet structure configured to pick-up a semiconductor chip. The collet structure may include a holder, a plate, an absorption member and an edge contact. The holder may be configured to downwardly receive vacuum. The holder may include a magnet arranged in the holder. The plate may include an upper surface magnetically and mechanically combined with the holder. The plate may include a sidewall wholly exposed by the holder. The plate may receive the vacuum from the holder. The absorption member may make contact with the plate to pick-up the semiconductor chip using the vacuum received from the plate. The edge contact may include a protrusion having a first length protruded from an edge portion of a bottom surface of the holder to make contact with the plate.

Collet structure and semiconductor fabricating apparatus including the same

According to the embodiment of the present disclosure, an organo tin compound is represented by the following Chemical Formula 1:

Organo tin compound for thin film deposition and method for forming tin-containing thin film using same

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Gyeonggi-do, South Korea

Tae Hwan Lim