Samsung Electronics Co., Ltd.

Hyundai Motor Company

Kia Motors Corporation

Tae-Hwa Kim

Jaehyun Lee

Kangmin Jeon

Kyounghoon Han

Jung Min Kim

Junghyun Cho

Dongsoo Lee

Min-pyo Hong

Dougyong Sung

Hyung Joo Lee

Kyung-Sun Kim

Jae-Hyun Lee

Heungsik Park

Namjun Kang

Minjoon Park

Baek-ho Heo

Chanhoon Park

Sung-Won Park

Byungbok Kang

Hyeon-Uk Kim

Jun-Hee Park

Hyun-Koo Lee

Sangdong Kwon

A spacer structure, which connects an insulating substrate and a semiconductor chip of a double-sided-cooled power module, includes: a conductive material layer which is composed of a composite material; an underlying plating layer disposed on the conductive material layer; and a copper plating layer disposed on the underlying plating layer, in which the copper plating layer is in contact with a joining material that joins the spacer to the semiconductor chip and the insulating substrate.

Spacer structure for double-sided-cooled power module and method of manufacturing the same

Disclosed are an electrostatic chuck assembly and a substrate processing apparatus including the same. The substrate processing apparatus comprises a process chamber including an inner space therein, a gas supply unit supplying a process gas into the process chamber, a top electrode section in the process chamber and generating plasma from the process gas, and an electrostatic chuck assembly below the top electrode section in the process chamber. The electrostatic chuck assembly comprises an electrostatic chuck supporting a substrate, a focus ring surrounding an upper portion of the electrostatic chuck, an electrode ring below the focus ring and including a different material from the focus ring, and a brazed bonding layer brazing the focus ring and the electrode ring together, the brazed bonding layer being between the focus ring and the electrode ring.

Electrostatic chuck assembly and substrate processing apparatus including the same

A method of fabricating a semiconductor device includes etching a stack of first-material layers and second-material layers alternately disposed one on another on a substrate. An upper portion of the stack is etched using an end point detection (EPD) signal of an etching reaction gas, and a function of an injection time of an etchant with respect to a depth of an opening is obtained while the upper portion of the stack is etched. A lower portion of the stack is etched using the obtained function.

Method of fabricating semiconductor device

Provided are a method and a system for managing semiconductor manufacturing equipment. The method may be performed using an equipment computer and may include ordering to perform a preventive maintenance to a chamber and parts in the chamber, monitoring a result of the preventive maintenance to the chamber and the parts, and performing a manufacturing process using plasma reaction in the chamber, if the result of the preventive maintenance is normal. The monitoring the result of the preventive maintenance may include a pre-screening method monitoring the result of the preventive maintenance using electric reflection coefficients obtained from the chamber and the parts without using the plasma reaction.

Method and system managing execution of preventative maintenance operation in semiconductor manufacturing equipment

Provided are a substrate manufacturing method and a substrate manufacturing apparatus used therefor. The substrate manufacturing method includes providing a substrate having a mask film into a chamber. A plasma reaction is induced in the chamber. A first gas and a second gas are alternately provided into the chamber to etch the substrate. Each of the first and second gases is provided into the chamber at a stabilized feed pressure including a pressure fluctuation profile comprising a square wave shape.

Substrate manufacturing method and substrate manufacturing apparatus

A suspension assembly and an actuator having the same, which are of a hard disk drive (HDD). The suspension assembly includes a load beam coupled to an end of a swing arm of an actuator; a flexure attached to the load beam to support the slider; and a tip-tab which extends from a front end of the load beam to contact a ramp when the read/write head is parked, wherein a width of a contact part of the tip-tab that contacts the ramp is wider than other parts of the tip-tab. A width of a part of the tip-tab engaged with the load beam and a width of a front part of the tip-tab are smaller than the width of the contact part. The width of the tip-tab increases gradually from the front end of the load beam up to the contact part, and decreases gradually after the contact part.

Suspension assembly and actuator having the same in hard disk drive

Growing community of inventors

Hwaseong-si, South Korea

Tae-Hwa Kim