Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Tae Hong Min

Jung-Hwan Kim

Kwang-Chul Choi

Myung Sam Kang

Un-Byoung Kang

Young Gwan Ko

Ju Ho Kim

Ji Hwang Kim

Jihwan Hwang

Seyoung Jeong

Sangwon Kim

Jung Soo Kim

Jin Won Lee

Chungsun Lee

Hojin Lee

Taeje Cho

Sang-Sick Park

Dae Jung Byun

Geol Nam

Chi Won Hwang

Young Kun Jee

Sang Hyun Sim

Sa Yong Lee

Eun-Kyoung Choi

Jae-hyun Phee

Minseung Yoon

Ho Hyung Ham

Yong Soon Jang

Hyung Ki Lee

Ki Suk Kim

Chang Min Ha

Il Jong Seo

Ho-jin Lee

Ju-Il Choi

Chajea Jo

Yun Seok Choi

Jung Woo Choi

In Young Lee

Sung Won Jeong

Kyu-ha Lee

Mi Sun Hwang

Teak Hoon Lee

Jung Han Lee

Ji Hwan Hwang

Un Byoung Kang

Tae Je Cho

Jin Ho Hong

Sunpil Youn

Jin Hyuk Jang

Seon Ha Kang

Min Jae Seong

Go Eun Lee

Seongmin Ryu

Sang Sick Park

Byoung Soo Kwak

Eun Su Kwon

A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.

Connection structure embedded substrate and substrate structure including the same

A printed circuit board includes a first insulating layer, a first pattern buried in a surface of the first insulating layer, the first pattern having a surface exposed from the surface of the first insulating layer, and a metal post disposed on the exposed surface of the first pattern. The metal post includes a first metal layer and a second metal layer. The first metal layer and the second metal layer include different metals.

Printed circuit board including an insulating layer and a metal post

A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

Printed circuit board

A printed circuit board and an antenna module including the same are provided. The printed circuit board includes a core layer; a first build-up structure disposed on an upper side of the core layer, including first insulating layers and first bonding layers, alternately stacked, and further including first wiring layers disposed on upper surfaces of the first insulating layers, respectively, and embedded in the first bonding layers, respectively; and a second build-up structure disposed on a lower side of the core layer, including second insulating layers and second bonding layers, alternately stacked, and further including second wiring layers disposed on lower surfaces of the second insulating layers, respectively, and embedded in the second bonding layers, respectively. The printed circuit board has a through-portion penetrating through the core layer and the second build-up structure, and has a region in which the through-portion is disposed as a flexible region.

Printed circuit board and antenna module comprising the same

A printed circuit board has a first stacked body having a flexible region and a rigid region, and a second stacked body disposed on the rigid region of the first stacked body. The first stacked body includes a plurality of first insulating layers, a plurality of first bonding layers, and a plurality of first wiring layers. The second stacked body includes a plurality of second insulating layers and a plurality of second wiring layers, and each of the plurality of first bonding layers integrally covers at least a portion of upper and side surfaces of a respective first wiring layer of the plurality of first wiring layers.

An antenna module includes: a wiring structure including a plurality of insulating layers and a plurality of wiring layers; a metal structure disposed on one surface of the wiring structure, and having a through-portion; and an antenna disposed on the one surface of the wiring structure. At least a portion of the antenna is disposed in the through-portion.

Antenna module

The present disclosure relates to a printed circuit board. The printed circuit board includes: a first substrate portion having a rigid region and a flexible region; and a second substrate portion disposed on the first substrate portion. The first substrate portion and the second substrate portion are disposed to be shifted such that portions of each of the first substrate portion and the second substrate portion overlap each other.

A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulating layer bendable with respect to the first substrate portion. The second substrate portion includes a block member disposed in the flexible insulating layer and a circuit pattern disposed on a region of the flexible insulating layer, in which the block member is embedded.

A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulation layer which is bendable, and the second substrate portion includes a frame member inserted into the flexible insulation layer.

A semiconductor package includes a first semiconductor chip having a first through substrate via (TSV), a second semiconductor chip stacked on the first semiconductor chip and a first adhesive layer disposed between the first semiconductor chip and the second semiconductor chip. The second semiconductor chip includes a second through substrate via connected to the first through substrate via. A side surface of the first adhesive layer is recessed from side surfaces of the first and second semiconductor chips.

Semiconductor package having recessed adhesive layer between stacked chips

There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a coil part; and cover parts disposed on upper and lower surfaces of the body. The coil part includes a plurality of through-vias penetrating through the upper and lower surfaces of the body and connection patterns disposed on the upper and lower surfaces of the body, disposed in the cover parts, and connecting the plurality of through-vias to each other.

Inductor and method of manufacturing the same

A semiconductor package includes a plurality of semiconductor chips on a substrate. The semiconductor chips include a first semiconductor chip, a second semiconductor chip, and a third semiconductor chip that are sequentially stacked on the substrate. The semiconductor package further includes a plurality of non-conductive layers between the substrate and the first semiconductor chip and between adjacent semiconductor chips among the semiconductor chips. The semiconductor chips include smaller widths as a distance from the substrate increases. Each of the non-conductive layers includes an extension protruding outward from a side surface of an overlying one of the semiconductor chips.

Semiconductor packages

There is provided a semiconductor device, enhanced with process capability and reliability by way of flow control of an adhesive material to fix semiconductor chips. The semiconductor device includes a first semiconductor chip including a first surface and a second surface opposite to each other, a flow regulating structure formed at the first surface of the first semiconductor chip, and a second semiconductor chip mounted on the first surface of the first semiconductor chip. The second semiconductor chip overlaps at least a portion of the flow regulating structure.

Semiconductor device including multiple semiconductor chips

Growing community of inventors

Suwon-si, South Korea

Tae Hong Min