Samsung Electro-mechanics Co., Ltd.

Samsung Led Co., Ltd.

Tae Hong Lee

Kyung Seob Oh

Min Sang Lee

Won Hoe Koo

The present invention relates to a light emitting diode module capable of facilitating the connection between light emitting diode modules. The present invention provides a light emitting diode module including an insulating layer, a first circuit pattern layer and a second circuit pattern layer which are stacked on a top surface and a bottom surface of the insulating layer respectively and have one ends protruding to an outside of the insulating layer and the other ends positioned inside the insulating layer, a solder resist layer coated on the first circuit pattern layer, a first via formed vertically through a portion of the solder resist layer to be electrically connected to the first circuit pattern layer, a second via formed vertically through a portion of the solder resist layer and the insulating layer to be electrically connected to the second circuit pattern layer and a light emitting element mounted on the solder resist layer.

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Seoul, South Korea

Tae Hong Lee