Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Kcc Corporation

Tae Ho Ko

Jong Hyun Park

Dae Hee Lee

Myeong Ho Hong

Hyun Chul Jung

Doo Hwan Lee

Do Young Jeong

Bong Soo Kim

Byoung Woo Ryu

Dae Jung Byun

Eun Sil Kim

Joon Seok Oh

Yeong A Kim

Chang Jae Lee

Kyoung Hoon Kang

Seok Jun Ahn

Kyong Bok Hur

Jun Ho Kang

Soo Hwan Park

Provided in a semiconductor package substrate including a semiconductor chip including a connection pad, an encapsulant encapsulating at least a portion of the semiconductor chip, a connection member disposed on the semiconductor chip and the encapsulant, the connection member including a redistribution layer that is electrically connected to the connection pad, a first passivation layer disposed on the connection member, and an adhesive layer disposed on at least one of a top surface of the encapsulant and a bottom surface of the first passivation layer in a region outside of the semiconductor chip.

Semiconductor package substrate and method of manufacturing semiconductor package using the same

A fan-out semiconductor package includes: a fan-out semiconductor package may include: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip; and a reinforcing layer disposed on the encapsulant. The first interconnection member and the second interconnection member respectively include redistribution layers electrically connected to the connection pads of the semiconductor chip.

Fan-out semiconductor package

A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole, a first encapsulant encapsulating at least portions of the first connection member and the semiconductor chip, a second connection member disposed on the first connection member and the semiconductor chip. The first connection member and the second connection member respectively include redistribution layers electrically connected to the connection pads of the semiconductor chip. The fan-out semiconductor package may have excellent rigidity, may be thinned, and may be manufactured in a simplified process.

Disclosed herein are a copper clad laminate, a printed circuit board, and a method of manufacturing the same. The copper clad laminate includes: an insulating layer having one surface and the other surface; and first and second copper foil layers having one surface, which is a smooth surface, and the other surface, which is a rough surface having a roughness larger than that of the smooth surface, respectively, wherein one surface of the insulating layer contacts the rough surface of the first copper foil layer and the other surface of the insulating layer contacts the smooth surface of the second copper foil layer.

Copper clad laminate, printed circuit board, and method of manufacturing the same

A power supply may include a driving power supply unit converting input power to supply driving power to a load, and a power supply control unit performing a control to detect a change in a voltage level of the driving power and cut off the input power when the detected voltage level of the driving power is equal to or more than a preset voltage level, in a preset standby mode.

Power supply

Growing community of inventors

Suwon-si, South Korea

Tae Ho Ko