University of Illinois

Advanced Diamond Technologies, Inc.

Tae Ho Kim

Matthew Alexander Meitl

John A Rogers

Etienne Menard

John Arthur Carlisle

Won Mook Choi

Dae Hyeong Kim

Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.

Printable, flexible and stretchable diamond for thermal management

Growing community of inventors

Masan, South Korea

Tae Ho Kim