Samsung Electronics Co., Ltd.

Other

Tae-Ho Kang

Yong-Suk Lee

Sung-Woo Choi

Bo-Seong Kim

Jin-Ho Kim

Joon-Hyung Kim

Behnam Pourdeyhimi

H Troy Nagle

Hyuk-Su Kim

Carey Reid Merritt

Edward R Grant

Won-Cheol Lee

Tae-hee Song

Burcak Karaguzel

A semiconductor package includes a mold substrate, at least one first semiconductor chip in the mold substrate and including chip pads, wiring bonding pads formed at a first surface of the mold substrate and connected to the chip pads by bonding wires, and a redistribution wiring layer covering the first surface of the mold substrate and including redistribution wirings connected to the wiring bonding wirings.

Semiconductor package and method of manufacturing the semiconductor package

A semiconductor package including a first lower stack on a substrate and including first lower semiconductor chips, a redistribution substrate on the first lower stack, a redistribution connector electrically connecting the substrate to the redistribution substrate, a first upper stack on the redistribution substrate and including first upper semiconductor chips, a first upper connector electrically connecting the redistribution substrate to the first upper stack, a second upper stack horizontally spaced apart from the first upper stack and including second upper semiconductor chips, and a second upper connector electrically connecting the redistribution substrate to the second upper stack may be provided. The redistribution connector may be on one side of the redistribution substrate. The first upper connector may be on one side of the first upper stack. The second upper connector may be on one side of the second upper stack.

Semiconductor package

A method comprising: receiving, by an electronic device, a first signal having a first frequency; identifying, by the electronic device, at least one of a strength of the first signal or a signal-to-noise ratio of the first signal; outputting, by the electronic device, a second signal having a second frequency that is different from the first frequency, the second signal being output based on at least one of the strength of the first signal or the signal-to-noise ratio of the first signal; receiving the second signal by the electronic device; and detecting whether the electronic device is at least partially immersed in a liquid based on the received second signal.

Method and apparatus for detecting that a device is immersed in a liquid

A two-wheeled self-balancing wheelchair is provided, including: a housing having support brackets which are mounted directly below rotary shafts of the motors located at both sides of the bottom side of the housing, rotary shafts of the motors which are drawn out from the housing, and wheels which are mounted to the rotary shafts and rotate in a way as to read an inclination angle of a rider's body; a saddle frame which is mounted on the upper part of the housing; and multipoint supports mounted at the front and rear of the support brackets, each of the multipoint supports having a first hinge part and a second hinge part which are formed at the front ends of the multipoint support to be able to rotate by bolts and are connected with each other through a connection bar and a third hinge part.

Two-wheeled self-balancing wheelchair

Provided are a curved semiconductor package, and a device including the semiconductor package. The semiconductor package includes: a flexible printed circuit board (PCB) including a fixed bent portion formed as an arch-shape and including a first surface facing a first direction and a second surface opposite to the first surface; at least one semiconductor chip attached to the second surface of the fixed bent portion of the flexible PCB; and a mold layer having rigidity and formed on the second surface of the fixed bending portion of the flexible PCB while surrounding the at least one semiconductor chip.

Semiconductor package and electronic apparatus including the same

Provided are a multi-chip package and a method of manufacturing the same, which can facilitate wire bonding even when an upper chip is larger than a lower chip or overhangs a lower chip. A multi-chip package includes a substrate having first and second bonding pads on a top surface thereof, a first chip connected to the first bonding pads on the substrate, an insulating layer formed on the substrate so as to surround lateral surfaces of the first chip, a set of openings formed in the insulating layer so as to expose the second bonding pads, and a second chip formed on the insulating layer and the first chip, the second chip having a larger area than the first chip and connected to the second bonding pads using wires that pass through the second openings.

Multi-chip package and method of manufacturing thereof

A capacitive sensor device, including electrode materials carried by fabric substrates, is provided for monitoring relative movement of an expanding and/or contracting structure, such as the mammalian chest and/or torso, corresponding to a performance parameter related, for example, to respiratory function. Some embodiments include non-woven fabric substrates comprising compliant portions configured to stretch only in a selected direction and non-compliant portions upon which electrode materials are disposed. In some embodiments, layers of fabric substrates, carrying corresponding first and second electrode materials, are configured to cooperate to form a parallel plate capacitive sensor having a variable capacitance corresponding to a relative motion of the fabric substrates.

Growing community of inventors

Gyeonggi-do, South Korea

Tae-Ho Kang