Wonik Ips Co., Ltd.

Tae Ho Ham

Cheol Woo Lee

Kwang Ha Choi

Jun Hyeong Lee

Da Been Kim

Disclosed herein is a substrate processing apparatus including a process chamber having a processing space defined therein to process a plurality of substrates, a gas injector provided on a upper side of the process chamber to inject a processing gas into the processing space, a plurality of substrate supports arranged inside the process chamber, the substrates being seated on the substrate supports, a substrate conveyor disposed in the process chamber to convey the plurality of substrates to different substrate supports among the substrate supports, and a substrate rotating part arranged to allow each of the plurality of substrates to be seated between neighboring ones of the plurality of substrate supports, and to rotate the substrates, wherein the substrate rotating part may include a tension adjuster disposed on at least a portion of the power transmitter to adjust a tension in the power transmitter.

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Pyeongtaek-Si, South Korea

Tae Ho Ham