Samsung Electronics Co., Ltd.

Tae-Heum Kim

Sang-Sub Song

Ki-Hong Jeong

Sung-wook Hwang

Yeoung-jun Cho

A solid state drive (SSD) package type has a lower package including a lower package substrate, a controller chip mounted on the lower package substrate, and a plurality of upper packages disposed on the lower package as spaced apart from each other. The plurality of upper packages includes at least one non-volatile memory and at least one first individual electronic component. The upper packages are electrically connected to the lower package such that the package type is a package-on-package (PoP) type. The height of the first individual electronic component is greater than the spacing between the lower package and each of the upper packages.

Growing community of inventors

Suwon-si, South Korea

Tae-Heum Kim