Samsung Electronics Co., Ltd.

Sungkyunkwan University

Vatech Ewoo Holdings Co., Ltd.

Vatech Co., Ltd.

Skhynix Inc.

Samsung Electro-Mechanics Co., Ltd.

Eo Technics Co., Ltd

Woorien Co., Ltd.

Tae Hee Han

Yong Ho Baek

Young Sik Hur

Dong Wan Seo

Min Keun Kim

Se Yeol Im

Yong Wook Kim

Jung Hyun Cho

Jae Hee Lee

Joo Yong Lee

Nam Hoon Lee

Hyun Joong Kim

Jeong Beom Hong

Jin Won Ma

Bong Ju Lee

Byung Joo Oh

Ill Hyun Park

Nam Ki Cho

Chang Seong Hong

Tae Woo Kim

Sung Il Choi

Moon Il Kim

Byoung Chan Kim

Jun Sun Hwang

Dongwook Suh

Woo-Cheol Lee

Sung Hwan Lim

Jinwoo Roh

Chang Lin Li

Jo Eun Lee

Min Gu Kang

Min Su Kim

Yong Joo Yang

In Choi

A method of quantifying a size of a tissue of interest in a animal through a device including a storage, an image processor, and a display by using an X-ray image of the animal is proposed. The proposed method may include storing the X-ray image in the storage, displaying the X-ray image on the display, performing, by the image processor, processes of (i) calculating a reference value for a length of a reference tissue of the animal displayed on the X-ray image, (ii) calculating a value of a length in at least one specific direction of the tissue of interest of the animal displayed on the X-ray image, and (iii) quantifying the size of the tissue of interest as a ratio of the value of the length to the reference value, and displaying the quantified size of the tissue of interest on the display.

Method and device for quantifying size of tissue of interest of animal by using X-ray image of animal

Provided is an X-ray image apparatus. The X-ray imaging apparatus include an imaging body and a control circuit. The image body acquires X-ray image data of an object and includes an X-ray generation device and an X-ray sensing device. The X-ray generating device and the X-ray sensing device are disposed to face each other with the object in between. The control circuit reconfigures an X-ray image of the object based on the X-ray image data, acquire size information of the object, rotate the X-ray generation device and the X-ray sensing device about a rotation axis between the X-ray generation device and the X-ray sensing device, and move the object along a direction of the rotation axis with respect to the X-ray generation device and the X-ray sensing device when acquiring the X-ray image data.

X-ray imaging apparatus

Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

Monitoring device, monitoring method and method of manufacturing semiconductor device using reflectivity of wafer

A simulation method and simulator for a system including a plurality of microring resonators, where the simulation method includes converting the plurality of microring resonators into an equivalent model, generating a virtual system including the equivalent model, inputting an input signal to the virtual system, and outputting an output signal from the virtual system.

Simulation method and simulater for optical network-on-chip system

Disclosed is a method of operating a non-volatile memory device. A method of operating a non-volatile memory device according to an embodiment of the present disclosure, in a method of operating a non-volatile memory device including a log storage area, a data storage area, and an ACK generation unit, may include receiving a log and data from a cache memory, storing the received log in the log storage area, storing the received data in the data storage area, and transmitting an ACK signal to the cache memory according to a result of storing the log and the data.

Non-volatile memory storage, computing system including the same and operation method thereof

A task mapping method of a NoC semiconductor device includes assigning a first task of a plurality of tasks for node control of the NoC semiconductor device to a first node of a first chip; computing tag values of second tasks of the plurality of tasks which are not assigned to the first node; and assigning the second tasks to a second node according to the tag values.

Task mapping method of network-on-chip semiconductor device

There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having athrough-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, andan optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

Fan-out sensor package and optical fingerprint sensor module including the same

There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

A fan-out fingerprint sensor package includes a first connection member having a through-hole, a fingerprint sensor disposed in the through-hole, an encapsulant encapsulating at least portions of the first connection member and the fingerprint sensor, and a second connection member disposed on the first connection member and an active surface of the fingerprint sensor. The first connection member includes a distribution layer. The second connection member includes a first insulating layer disposed on the distribution layer and the active surface, a redistribution layer disposed on the first insulating layer, a first via connecting the redistribution layer to a connection pad of the fingerprint sensor, and a second via connecting the redistribution layer to the distribution layer. The first via passes through the first insulating layer and at least a portion of the encapsulant, and the second via passes through the first insulating layer.

Fan-out fingerprint sensor package

A fan-out semiconductor package includes first and second structures. The first structure includes a first semiconductor chip, a first encapsulant, and a connection member. The second structure includes a second semiconductor chip, a second encapsulant, and conductive bumps. The first and second structures are disposed so that active surfaces of the first and second semiconductor chips face each other. The conductive bumps are electrically connected to a redistribution layer, and connection pads of the first and second semiconductor chips are connected to each other through the redistribution layer in a signal manner. Signal transmission times between one point of the redistribution layer and connection pads of each of the first and second semiconductor chips are substantially the same as each other.

Fan-out semiconductor package

According to an exemplary embodiment of the present disclosure, a method of generating a network-on-chip (NoC) in an electronic device includes clustering a plurality of cores based on total communication energy comprising first communication energy between a plurality of voltage-frequency-islands (VFIs) and second communication energy inside the plurality of VFIs.

Apparatus and method for generating a network on chip in an electronic device

A medical image reconstruction system and method for correcting a CT image such that the CT image is located at the center of a three-dimensional (3D) space in order to overcome an error that would otherwise be formed due to an inaccurate position of a patient during Obtaining CT images. After the 3D spatial positions of a 3D medical image are corrected using 3D medical image data, a trajectory of a dental arch is detected. A two-dimensional (2D) medical image is created from the 3D medical image through automatic reconstruction on the basis of the detected trajectory of the dental arch.

Apparatus and method for reconstructing medical image

A semiconductor device includes a plurality of semiconductor chips vertically stacked and electrically coupled to one another through TSVs (Through-Silicon Vias), a plurality of semiconductor elements formed in each of the semiconductor chips, a plurality of nodes suitable for coupling the semiconductor elements to one another, and a node control device suitable for being provided in each of the nodes, deciding whether to couple the node to a communication path based on a temperature of the node, and setting a shortest communication path among the semiconductor elements.

Semiconductor device having network-on-chip structure and routing method thereof

Growing community of inventors

Gyeonggi-do, South Korea

Tae Hee Han