Seoul Viosys Co., Ltd.

Skhynix Inc.

Lg Display Co., Ltd.

Tae Gyun Kim

Kyu Ho Lee

Tae Kyung Kim

Chan Seob Shin

Hyoung Jin Lim

Sung Won Tae

Hee Youl Lee

Dong Hun Lee

Yeo Jin Yoon

Shin Hyoung Kim

Chang Yeon Kim

Kyoung Wan Kim

Seom Geun Lee

Chi Wook An

Joon Hee Lee

Ye Seul Kim

Jong Kyun You

Sung Su Son

Jung Shik Jang

Ji Hyun Seo

Da Hye Kim

Seon Min Bae

Young Wug Kim

Se Hoon Kim

Tae Hyuk Im

Ki Hyun Kim

Jun Woong Lee

A UV light emitting diode includes a substrate having a plurality of holes surrounded by a flat surface, a first conductivity type semiconductor layer disposed on the substrate, a second conductivity type semiconductor layer disposed on the first conductivity type semiconductor layer, an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer. A distance from the flat surface to the active layer is smaller than a distance from bottom surfaces of the plurality of holes to the active layer. The flat surface is in contact with the first conductivity type semiconductor layer.

UV light emitting diode

A deep UV light emitting diode includes a substrate, an n-type semiconductor layer located on the substrate, a mesa disposed on the n-type semiconductor layer, and including an active layer and a p-type semiconductor layer, an n-ohmic contact layer in contact with the n-type semiconductor layer, a p-ohmic contact layer in contact with the p-type semiconductor layer, an n-bump electrically connected to the n-ohmic contact layer, and a p-bump electrically connected to the p-ohmic contact layer. The mesa includes a plurality of vias exposing a first conductivity type semiconductor layer.

Deep UV light emitting diode

A light emitting diode includes a light emitting structure including first and second conductive type semiconductor layers, an active layer, a first electrode electrically connected to the first conductive type semiconductor layer, a current blocking layer disposed on a lower surface of the light emitting structure, and a second electrode electrically connected to the second conductive type semiconductor layer. The second electrode includes a first reflective metal layer adjoining the second conductive type semiconductor layer, and a second reflective metal layer covering a lower surface of the current blocking layer and a lower surface of the first reflective metal layer, and adjoining the second conductive type semiconductor layer. A contact resistance between the second reflective metal layer and the second conductive type semiconductor layer is higher than a contact resistance between the first reflective metal layer and the second conductive type semiconductor layer.

Light emitting diode with high efficiency

Disclosed herein are a light emitting diode including a plurality of protrusions including zinc oxide and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, the light emitting diode includes: a substrate; a nitride light emitting structure disposed on the substrate; and a transparent electrode layer disposed on the nitride light emitting structure, wherein the transparent electrode layer includes a plurality of protrusions, the plurality of protrusions each have a lower portion and an upper portion, and a side of the lower portion and a side of the upper portion have different gradients.

Light emitting diode and method of manufacturing the same

Provided is a semiconductor device including a plurality of pillar columns, each of the plurality of pillar columns including a plurality of pillars arranged in one direction to be offset from each other, wherein an mth pillar and an (m+1)th pillar, among the plurality of pillars included in each pillar column, are aligned with each other (m is an integer of 0 or more).

Semiconductor device

A light-emitting device according to an exemplary embodiment of the present invention includes a first conductivity-type semiconductor layer disposed on a substrate; an active layer disposed on the first conductivity-type semiconductor layer; a second conductivity-type semiconductor layer disposed on the active layer; and an irregular convex-concave pattern disposed on a surface of the first conductivity-type semiconductor layer. The irregular convex-concave pattern includes convex portions and concave portions, and the convex portions have irregular heights and the concave portions have irregular depths. The first conductivity-type semiconductor layer including the irregular convex-concave pattern is exposed from the active layer and the second conductivity-type semiconductor layer.

Light emitting device and method of fabricating the same

Provided are a semiconductor memory device and an operating method thereof. The semiconductor memory device may include a memory cell array having a plurality of strings each including a drain select transistor, a plurality of drain side memory cells, a pipe transistor, a plurality of source side memory cells, and a source select transistor. The semiconductor memory device may also include a peripheral circuit suitable for providing a plurality of operation voltages including an erase verify voltage to the plurality of strings, and a control logic suitable for controlling the peripheral circuit to adjust a voltage level of the erase verify voltage applied to a selected memory cell, from among the plurality of drain side memory cells and the plurality of source side memory cells, according to a distance between the selected memory cell and the pipe transistor when an erase verify operation is performed.

Semiconductor memory device and operating method thereof

The photo mask includes a mask substrate, and a mask pattern formed to include a plurality of unit mask patterns which are arranged in a single line for a fine pattern formation. The unit mask pattern is configured to include a body portion positioned at a center and wing portions formed in a triangular shape at both sides of the body portion.

Photo mask and method of manufacturing in-plane switching mode liquid crystal display device using the same

Exemplary embodiments of the present invention disclose a method of fabricating a gallium nitride (GaN) based semiconductor device. The method includes growing GaN based semiconductor layers on a first surface of a GaN substrate to form a semiconductor stack, and separating at least a first portion of the GaN substrate from the semiconductor stack using a wire cutting technique.

Method of fabricating gallium nitride based semiconductor device

A writing method of a semiconductor memory device includes applying a plurality of program voltages sequentially generated to a selected word line, and applying any one of a plurality of source selection line voltages to a source selection line when each of the plurality of program voltages is applied.

Semiconductor memory device and writing method thereof

A semiconductor device includes a semiconductor substrate including a first driving transistor region having a first driving transistor disposed therein and a second driving transistor region having a second driving transistor disposed therein, wherein the second driving transistor is driven at a lower voltage than the first driving transistor, a first gate insulating layer formed at edges of the second driving transistor region, and a second gate insulating layer formed at a center of the second driving transistor region, wherein the first gate insulating layer is thicker than the second gate insulating layer.

Semiconductor memory device and method of manufacturing the same

A photo mask is disclosed. The photo mask includes a mask substrate, and a mask pattern formed to include a plurality of unit mask patterns which are arranged in a single line for a fine pattern formation. The unit mask pattern is configured to include a body portion positioned at a center and wing portions formed in a triangular shape at both sides of the body portion.

Growing community of inventors

Gyeonggi-do, South Korea

Tae Gyun Kim