Dongbu Hitek Co., Ltd.

Samsung Mobile Display Co., Ltd.

Tae Gyu Kim

Jin Tae Jeong

Provided are an image sensor and a method for manufacturing the same. The image sensor comprises a semiconductor substrate, an interconnection and an interlayer dielectric, a lower electrode layer, an image sensing device, a first via hole, a barrier pattern, a second via hole, and a metal contact. The semiconductor substrate comprises a readout circuitry. The interconnection and the interlayer dielectric are formed on the semiconductor substrate. The lower electrode layer is disposed over the interlayer dielectric. The image sensing device is disposed on the lower electrode layer. The first via hole is formed through the image sensing device. The barrier pattern is formed on a sidewall of the first via hole. The second via hole is formed through the lower electrode layer and the interlayer dielectric under the first via hole. The metal contact is formed in the first and second via holes.

Image sensor and method for manufacturing the same

Provided are image sensors and methods of manufacturing the same. An image sensor includes a metal line and an interlayer insulation layer on a semiconductor substrate including a readout circuit; an image detection unit on the interlayer insulation layer and including stacked first and second doping layers; a pixel separation unit penetrating the image detection unit, separating the image detection unit by pixel; a first metal contact penetrating the image detection unit and the interlayer insulation layer to contact the metal line; a first barrier pattern protecting the first metal contact from contacting the second doping layer, while exposing the first metal contact to the first doping layer; and a second metal contact in a trench above the first metal contact, wherein the second metal contact is electrically connected to the second doping layer while being isolated from the first metal contact by a second barrier pattern.

Image sensor and method of manufacturing the same

Provided are an image sensor and a method for manufacturing the same. According to an embodiment, a semiconductor substrate is provided comprising a readout circuit. An interconnection electrically connected to the readout circuit and an interlayer dielectric are disposed over the semiconductor substrate. An image sensing unit is disposed over the interlayer dielectric and comprises a first doping layer and a second doping layer stacked therein. A first via hole is formed, exposing the interconnection through the image sensing unit. A fourth metal contact is formed in the first via hole to electrically connect the interconnection and the first doping layer. A fifth metal contact is formed over the fourth metal contact, the fifth metal contact being electrically insulated from the fourth metal contact and electrically connected to the second doping layer.

A method for fabricating an image sensor is provided. In the image sensor fabrication method, an interconnection and a dielectric interlayer are formed on a semiconductor substrate including a readout circuit. An image sensing unit is formed on a carrier substrate of one side of a dielectric layer. The carrier substrate and the dielectric interlayer are bonded to each other. The dielectric layer and the carrier substrate are removed to leave the image sensing unit on the dielectric interlayer.

Method for fabricating image sensor

Disclosed is an image sensor. The image sensor includes a semiconductor substrate including a lower interconnection, a plurality of upper interconnection sections protruding upward from the semiconductor substrate, a first trench disposed between the upper interconnection sections such that the upper interconnection sections are spaced apart from each other, a bottom electrode disposed on an outer peripheral surfaces of the upper interconnection sections, a first conductive layer disposed on an outer peripheral surface of the bottom electrode, an intrinsic layer disposed on the semiconductor substrate including the first conductive layer and the first trench, and having a second trench on the first trench, a second conductive layer disposed on the intrinsic layer and having a third trench on the second trench, a light blocking part disposed in the third trench, and a top electrode disposed on the light blocking part and the second conductive layer.

Image sensor and manufacturing method thereof

An image sensor having greatly improved physical and electrical bonding forces between a photodiode and a substrate, and a manufacturing method thereof. The image sensor includes a semiconductor substrate and readout circuitry, a dielectric layer on the semiconductor substrate, a metal line in the dielectric layer, electrically connected with the readout circuitry, an image sensing device including first and second impurity regions on the dielectric layer, a via hole through the dielectric layer and the image sensing device, a hard mask in the via hole, and a lower electrode in the via hole to connect the first impurity region with the metal line.

Image sensor

An image sensor is provided. The image sensor comprises a semiconductor substrate, a dielectric interlayer, an interconnection, an image sensing unit, a via hole piercing the image sensing unit and the dielectric layer, and a bottom electrode. The semiconductor substrate includes a readout circuit. The dielectric interlayer is disposed on the semiconductor substrate. The interconnection is disposed in the dielectric interlayer and connected electrically to the readout circuit. The image sensing unit is disposed on the dielectric interlayer and includes a stack of a first impurity region and a second impurity region. The via hole pierces the image sensing unit and the dielectric interlayer to expose the interconnection. The bottom electrode is disposed in the via hole to electrically connect the interconnection and the first impurity region of the image sensing unit.

Image sensor and fabrication method thereof

An organic light emitting display device and a testing method thereof is provided. The organic light emitting display device may be used to perform a test of a sheet unit for a plurality of organic light emitting display devices formed on a mother substrate. The organic light emitting display device can separately turn off particular organic light emitting display devices. A display region includes a plurality of pixels, which are connected to scan lines and data lines. A scan driver supplies a scan signal to the scan lines. A peripheral region surrounds the display region and includes a first wiring group extending in a first direction and a second wiring group extending in a second direction. A transistor group includes a plurality of transistors, which are coupled with one end of the data lines. An on/off controller is coupled with at least one wiring of the first wiring group and at least one wiring of the second wiring group.

Organic light emitting display device and testing method thereof

Provided are an image sensor and a method of fabricating the same. The image sensor according to an embodiment includes a semiconductor substrate including a circuit region; a metal interconnection layer including a metal interconnection and an interlayer dielectric on the semiconductor substrate; a plurality of first pixel isolation layers on the interlayer dielectric, each of the first pixel isolation layers protruding above a top surface of the interlayer dielectric; and a light receiving portion between the first pixel isolation layers, the light receiving portion including protruding portions along sidewalls of the first pixel isolation layers.

Image sensor and method of fabricating the same

Disclosed is a phase clock generator. The phase clock generator can include transistors and a buffer. The transistors are connected between a power line and a grounding line and are provided in a form of a 4&#xd7;N matrix to receive a plurality of phase-delayed signals through their gate terminals. Four transistors can form a unit column between the power line and the grounding line. From ground line to power line, the first two transistors of the unit column provide a pair of NMOS transistors, and the second two transistors provide a pair of PMOS transistors. The buffer is connected to a line, which is provided between the pair of the NMOS transistors and the pair of the PMOS transistors forming the unit column, to transmit a clock signal.

Phase clock generator

Provided is an image sensor and a method for manufacturing the same. The image sensor includes a substrate on which a circuitry including a first lower metal line and a second lower metal line is formed. A lower electrode is formed on the first lower metal line. A separation metal pattern surrounds the lower electrode and connected to the second lower metal line. An intrinsic layer is formed on the lower electrode. A second conductive type conduction layer is formed on the intrinsic layer. An upper electrode is formed on the second conductive type conductive layer. A bias can be applied to the second lower metal line such that the separation metal pattern can provide a Schottky Barrier, directing electrons to the lower electrode and inhibiting crosstalk between pixels.

An image sensor and a method for manufacturing the same are provided. A photodiode region and transistor region are vertically-integrated to improve the fill factor and resolution of the image sensor. Unit pixels can be isolated by a metal isolation layer arranged between adjacent photodiode areas.

Growing community of inventors

Masan-si, South Korea

Tae Gyu Kim