Samsung Electronics Co., Ltd.

Tae-gyu Kim

Dong-Woo Lee

Su-ho Shin

Chang-hoon Jung

Dong-jin Seol

Hwan-guem Kim

Hwan-hee Kim

Jin-Sung Lee

Jun-Ho Lee

Tae-hoon Kim

Tae-sang Park

Sung-jin Lee

Je-hyoung Ryu

Jong-kill Lim

Seung-jun Lee

Seong-gu Kim

Si-hoon Lee

Sang-kwon Wee

Bang-weon Lee

Chel-jong Choi

Jeong-su Han

Jong-Bong Park

Jae-ho Baek

Bang-Weon Lee

Jong-soo Hong

Soon-kyu Yim

Hong-yong Lee

A formaldehyde detecting apparatus includes a formaldehyde sensor configured to measure concentration of formaldehyde in air; a printed circuit board on which the formaldehyde sensor is disposed, the printed circuit board including a signal processor configured to process a signal output from the formaldehyde sensor; a fixing member disposed on the printed circuit board, the fixing member configured to fix the formaldehyde sensor, wherein the fixing member prevents the formaldehyde sensor from oscillating with respect to the printed circuit board by external vibration; and a power supply configured to supply a voltage capable of stabilizing an output signal to the signal processor.

Formaldehyde detecting apparatus, and air treatment apparatus having the same

A fusing device includes a rotatable pressing roller, a fusing belt to rotate by a rotational force transmitted from the rotatable pressing roller, a nip forming member to contact an inner surface of the fusing belt to form a nip on a contact area between the rotatable pressing roller and the fusing belt, a heating member formed in approximately an internal central portion of the fusing belt to heat the nip forming member and the fusing belt, an inner support member formed within the fusing belt to press a nip part of the nip forming member toward the rotatable pressing roller, and an outer support member formed outside the fusing belt, and both ends of the outer support member being engaged with the inner support member to thereby reinforce the strength of the inner support member and form a path for radiation heat to disperse. The support unit includes an inner support member placed within the belt unit, and an outer support member placed outside the belt unit, both ends of the outer support member being engaged with the inner support member to reinforce the strength of the inner support member and to form a path for a radiation heat to disperse.

Fusing device and image forming apparatus having the same

A fusing apparatus includes a heating unit to generate heat to fuse an image onto a printing medium, a pressurizing roller that faces and contacts the heating unit having an endless fusing film that is rotated while facing and contacting the pressurizing roller and presses the printing medium toward the heating unit, a nip forming member including a main body formed inside the fusing film to surround a heat source and contacts a portion of the fusing film to the pressurizing roller to form a nip. The fusing apparatus further includes a supporting member to support the nip forming member.

Fusing apparatus and electrophotographic image-forming apparatus having the same

A fixing device includes a fixing roller, a fixing belt which is made to rotate by a rotation force received from the fixing roller, a nip forming unit to form a nip zone at a contact area between the fixing roller and the fixing belt, and a first heating unit, which is separated from the nip zone, to apply heat to the fixing belt. The nip zone and the heating unit are separated, so that the heating unit can be prevented from being broken as a result of the pressurization and thermal deformation.

Fixing device and image forming apparatus having the same

A fusing device includes a pressure unit, a belt unit to rotate in outer contact with the pressure unit, a nip forming unit to form a nip over a contact portion between the pressure unit and the belt unit, a heating unit to heat the nip forming unit and the belt unit, and a support unit to press and support the nip forming unit constantly and having a plurality of heat transmission portions defined in a parallelogrammic shape of an oblique direction with respect to a traveling direction of the belt unit.

A fusing device includes a pressing member, a belt member to rotate in contact with the pressing member, a nip forming member to support the belt member so that nip areas are formed on the pressing member and the belt member at contacting portions thereto, a heating member disposed away from the nip areas, to heat the belt member, and a tension application member to stiffen the belt member so that the heating member is tightly contacted with the belt member. The heating member includes a plate type heating element which is arranged at an upstream side of the nip areas, and to contact an inner circumference of the belt member, in an advancing direction of the fusing belt. The effective width of then nip areas increases, and the increased pressure is exerted to the nip areas, because the fusing belt enters a location where the nip areas are formed in a heated state. Furthermore, heating efficiency of the fusing belt is increased, because the fusing belt is heated while in a tight contact with the heating member. As a result, fusing performance is enhanced.

A fixing unit which enables high-speed operation and miniaturization, and an image forming apparatus having the fixing unit, includes a heating member which is heated by a heat source, the heating member having a predetermined width; a rotating member to rotate in contact with the heating member; a driving member to rotate the rotating member; and a pressing member to press both sides of the heating member towards the driving member and to form a predetermined fixing nip between the rotating member and the driving member, wherein the heating member has a second moment of inertia which is set to maintain a fixing efficiency of 90% or more in a central portion of the heating member.

Fixing unit and image forming apparatus having the same

A fixing device includes a pressing roller, a fixing belt to receive a rotation force transferred from the pressing roller and to rotate thereby, a nip forming member which is mounted inside the fixing belt, the nip forming member including a heat transmission unit formed thereon, and a heat source, which is mounted inside the nip forming member, to simultaneously apply heat to the nip forming member and to the fixing belt through the heat transmission unit.

A substrate surface processing apparatus is provided. In the substrate surface processing apparatus, a spin chuck holds a substrate thereon by suction, spins the substrate, and moves up and down the substrate. An upper bowl and a lower bowl surround the spin chuck for receiving a processing solution by which the surface of the substrate is processed. An air outlet is positioned under the lower bowl for exhausting air from the upper and lower bowls. A flow separation protrusion is formed within the upper bowl. It separates an air flow around the substrate into an upward air flow and a downward air flow and exhausts the downward air flow through the air outlet.

Apparatus for processing surface of substrate

A phase-change random access memory (PRAM) device including a plurality of nanowires and a method of manufacturing the same include: a lower structure including a plurality of contact plugs; the nanowires extending into the contact plugs from surfaces defining a respective terminal end of the contact plugs; and a phase-change layer formed on top of the nanowires. Therefore, a reset or a set current consumed by the PRAM device is significantly reduced.

Phase-change memory device including nanowires and method of manufacturing the same

A semiconductor wafer baking apparatus includes a hot plate, a container of which an upper part is open, and a cover that covers the upper part of the container. The cover includes an upper plate, a lower plate and a side wall that form a gas circulating space therebetween. At least one gas inlet is formed in the side wall, a plurality of gas supply holes are formed in a central region of the lower plate, and a skirt on which is formed a gas exhaust unit is coupled to a lower edge of the cover.

Semiconductor wafer baking apparatus

Provided is a bake system. The bake system includes a heating plate having a heating plate having a substrate on an upper surface. A case is disposed below the heating plate to support the heating plate; a first cover is disposed above the heating plate and coupled to the case to form a chamber; and a second cover is disposed in the first cover, and directly above the substrate in the bake process for preventing heat convection on the substrate.

Bake system

An inspecting apparatus for a semiconductor device having a match plate; a contact module combined with the match plate, including a radiation unit contacting a semiconductor device, and a test unit pressing leads of the semiconductor device; and a thermally conductive pad installed on a contacting face of the radiation unit of the contact module, to transfer heat from the semiconductor device to the radiation unit of the contact module. The present invention provides an inspecting apparatus for semiconductor devices that improves reliability of testing for durability of semiconductor devices against heat, and minimizes damage to the semiconductor devices during testing.

Inspecting apparatus for semiconductor device

A temperature measuring apparatus measures the temperature of a wafer in real time using a change of magnetic field during a thermal process. The temperature measuring apparatus includes: at least one conductive structure disposed on one surface of the wafer, in which an electrical conductivity of the conductive structure varies depending on temperature; a magnetic field generator installed facing the conductive structure with respect to a center of the wafer; and a magnetic field measuring sensor installed above the conductive structure.

Growing community of inventors

Hwaseong-si, South Korea

Tae-gyu Kim