Samsung Electronics Co., Ltd.

Tae-Duk Nam

Jin-Ho Kim

Tae-Young Lee

Hyuk-Su Kim

Hyoung-Suk Kim

Se-Yong Oh

Sung-Hwan Yoon

Sang-Hyeop Lee

Min-Keun Kwak

Chan-Suk Lee

A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate.

Semiconductor package having supporting plate and method of forming the same

The present invention provides an LOC package wherein the lead frame is in direct contact with the semiconductor device. The lead frame, which includes openings, is positioned directly on the semiconductor device. An adhesive material is applied in the opening in the lead frame. This adhesive material contacts both the lead frame and the semiconductor device. The lead frame is therefore securely held to the semiconductor device. Wires can then be bonded to contact pads on the semiconductor device and to the lead frame.

Lead on chip semiconductor package

Growing community of inventors

Seoul, South Korea

Tae-Duk Nam