Sharp Kabushiki Kaisha Corporation

Other

Tadayuki Into

Noriki Iwasaki

Satoru Fukunaga

Hiroshi Yasumura

Yasuhiro Goto

Tatsuyuki Ishioka

In a method of thinning a semiconductor wafer, a protection tape smaller in size than the semiconductor wafer is applied to a front of the semiconductor wafer, and a back of the semiconductor wafer is etched. In the etching process, a chemical liquid falls down from the semiconductor wafer without being accumulated on the protection tape because the protection tape is smaller in size than the semiconductor wafer.

Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers

A semiconductor chip pickup apparatus of the present invention includes an aspiration section and an aspiration unit connected to the aspiration section, in which the aspiration unit includes a stage for mounting the semiconductor chip thereon and an adhesive sheet is attached to the semiconductor chip between the stage and the semiconductor chip, the stage includes undulations in at least a part of an area in which the semiconductor chip is mounted, and by operating the aspiration section, a suction force is applied to at least a part of an area in which the undulations are formed.

Pickup apparatus for semiconductor chips

Growing community of inventors

Tenri, Japan

Tadayuki Into