Shinko Electric Industries Co., Ltd.

Nippon Tungsten Co., Ltd.

Japan Fine Ceramics Center

Philtech Inc.

Trek Holding Co., Ltd.

Tadayoshi Yoshikawa

Koki Tamagawa

Miki Saito

Norio Shiraiwa

Naoto Watanabe

Yuji Furumura

Naomi Mura

Mitsuyoshi Nagano

Toshio Uehara

Takahiko Suzuki

Hideaki Matsubara

Shuzo Aoki

Hiroshi Yonekura

Kouta Tsutsumi

Tetsushi Matsuda

A substrate fixing device includes a base plate including therein a gas supply section, and an electrostatic chuck provided on the base plate. The electrostatic chuck includes a base having a mounting surface on which a target to be held by electrostatic attraction is mounted, an insertion hole, penetrating the base, having an inner surface that defines the insertion hole and is threaded to form a female thread, and a screw member, having an outer surface that is threaded to form a male thread, and inserted into the insertion hole to assume a mated state in which the male thread mates with the female thread. A gas from the gas supply section is supplied to the mounting surface via the screw member.

Substrate fixing device

A tray includes a support base having both a first face on which a clamp object is placed and a second face opposite the first face, an upper electrode embedded in the support base and situated toward the first face, a lower electrode embedded in the support base and situated further toward the second face than the upper electrode is, and one or more interconnect lines configured to provide an electrical connection between the upper electrode and the lower electrode.

Tray and wafer holding apparatus

A dielectric layer for an electrostatic chuck is formed of a ceramic material having a first phase including aluminum oxide and a second phase including composite carbonitride (Ti, Me)(C, N) that contains titanium as fine grains. The Me represents a transition element and metals of Group 4 to Group 6 such as Mo and W. The ceramic material that includes the second phase by 0.05 vol % to 2.5 vol % has a volume resistivity value of about 10to 10(&#x3a9;&#xb7;cm) necessary for a Johnsen-Rahbek type electrostatic chuck.

Dielectric layer for electrostatic chuck and electrostatic chuck

A substrate including a sensor unit, wherein the sensor unit includes a coil wound at least once arranged on the surface of the sensor or embedded within and near the surface thereof. With such an arrangement, an electric current that corresponds to information with respect to the substrate (e.g., the temperature of the substrate or the amount of charge stored in the substrate) flows through the coil.

Substrate, substrate holding apparatus, analysis apparatus, program, detection system, semiconductor device, display apparatus, and semiconductor manufacturing apparatus

A substrate temperature control fixing apparatus comprises an electrostatic chuck which includes a base body and adsorbs and holds an adsorbing target mounted on one of surfaces of the base body, a base plate which supports the electrostatic chuck, and a bank portion provided on an outer periphery of one of surfaces of the base plate which is opposed to the other of the surfaces of the base body.

Substrate temperature control fixing apparatus

An electrostatic chuck includes a metal base member and an insulating substrate having an opposite surface to an attraction surface joined onto the base member via an adhesive layer. In the substrate, an electrode layer to which a direct current voltage for attraction is applied is embedded in a portion of the substrate, close to the attraction surface. In addition, a plurality of independent RF electrode layers to which different radio frequencies for plasma control are fed, respectively, are embedded in portions of the substrate, at an opposite side of the first electrode layer to the attraction surface. The RF electrode layers are arranged separately in different layers which are not on an identical plane in such a manner as to partially overlap each other in a plan view.

Substrate for electrostatic chuck and electrostatic chuck

Growing community of inventors

Nagano, Japan

Tadayoshi Yoshikawa