Fuji Electric Co., Ltd.

Fuji Electronic Co., Ltd.

Tadayoshi Ishii

Kenji Okamoto

Katsumi Yamada

Tomoyuki Kawashima

Mitsuaki Kirisawa

Kazuhiko Imamura

Kazuyuki Makita

In a semiconductor device having a laminated metal layer in which a metal layer whose main component is aluminum and a metal layer whose main component is nickel are laminated on each other, the ratio (t,/t,) of the thickness (t,) of the metal layer whose main component is aluminum to that (t,) of the metal layer whose main component is nickel is controlled to 5 or larger, so that part of the metal layer whose main component is aluminum remains even if an Al&mdash;Ni intermetallic compound is formed.

Semiconductor device

A solder is disposed outside a joint area without putting a solder foil in an area to be joined or performing preparatory soldering, and soldering is performed by making the melted solder permeate the joint area by a capillary phenomenon. Further, one member is supported by a solder, and a joint solder layer of desired thickness is obtained by use of a jig for supporting the one and the other member at a predetermined distance therebetween when the solder is melted. Further, if a solder outside a joint area is made to stand vertically in its longitudinal direction, and melted at such a state, pressure caused by self-weight is given to the melted solder, and oxide of the solder surface is separated from the melted solder, so that it is possible to further reduce the generation of voids.

Method of soldering

Growing community of inventors

Kanagawa, Japan

Tadayoshi Ishii