Tokai Electronics Co., Ltd.

Tadayoshi Haneda

Yuji Suzuki

Takeshi Matsumoto

Hideaki Imaichi

Koichi Himura

A resonant tag has one electrode plate of a capacitor and an electric circuit, which is electrically connected to the capacitor, formed on one surface of the insulating film composing the resonant circuit. On the other surface of the insulating film, the other electrode plate of the capacitor, which is electrically connected to the electric circuit, is formed. Heat pressing is performed on the insulating film existing between the two electrode plates with a predetermined pressure and at a predetermined temperature to shorten a distance between these electrode plates, and a crystal structure of the insulating film is destroyed to form a penetrating hole which penetrates through both the electrode plates.

Resonant tag and method of manufacturing the same

A resonant tag is manufactured in the manner described below: a conductive thin film is formed to a predetermined thickness on two surfaces of an insulating thin film. Thereafter, a conductive pattern, composed of an inductor element and a capacitor element corresponding to a resonant frequency of a resonant circuit, is printed on a surface of one of the conductive thin films, and a conductive pattern, composed of a capacitor element corresponding to the resonant frequency of the resonant circuit, is printed on a surface of the other insulating thin film at a position which faces the capacitor element formed on one of the conductive thin films using an ink which resists etching. A non-printed portion of the conductive thin films is removed by etching to form a resonant circuit pattern. Thereafter, a portion of the insulating thin film, which corresponds to the capacitor element pattern, is thinned to a desired thickness by pressing a heating/pressing member heated to a predetermined temperature against that portion under a predetermined pressure for a predetermined period of time.

Apparatus for manufacturing resonant tag

A resonant tag is manufactured in the manner described below: a conductive thin film is formed to a predetermined thickness on two surfaces of an insulating thin film. Thereafter, a conductive pattern, composed of an inductor element and a capacitor element corresponding to a resonant frequency of a resonant circuit, is printed on a surface of one of the conductive thin films, and a conductive pattern, composed of a capacitor element corresponding to the resonant frequency of the resonant circuit, is printed on a surface of the other insulating thin film at a position which faces the capacitor element formed on one of the conductive thin films using an ink which resists etching. A non-printed portion of the conductive thin films is removed by etching to form a resonant circuit pattern. Thereafter, a portion of the insulating thin film, which corresonds to the capacitor element pattern, is thinned to a desired thickness by pressing a heating/pressing member heated to a predetermined temperature against that portion under a predetermined pressure for a predetermined period of time.

Growing community of inventors

Chigasaki, Japan

Tadayoshi Haneda