Rohm Co., Ltd.

Tadatoshi Miwa

Takumi Yamade

Yasuyuki Aritaki

Kuniaki Nakamura

Naoki Sekiguchi

Tomoharu Horio

Torayuki Tsukada

Yuki Tanuma

Hiroyuki Tajiri

Akiko Araki

An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.

Image sensor module

An LED light source unit for a backlight of a liquid crystal display is provided. The light source unit includes a plurality of LED chips, an insulating substrate, and a metal film covering a principal surface of the substrate. The LED chips are mounted on the metal film. With this arrangement, brightness of the light source unit is enhanced.

LED light source unit for backlight of liquid crystal display, and liquid crystal display

A chip type variable electronic part includes an insulating substrate with a through hole, an adjustment rotor formed of a metal plate in a bowl shape to receive a screwdriver and disposed on the upper surface of the insulating substrate, an internal terminal electrode plate made of a metal plate disposed in close contact with a lower surface of the insulating substrate, and a shaft portion integrally formed with the internal terminal electrode plate to be fitted in the through hole. A bottom plate of the adjustment rotor is rotatably fitted to the upper end portion of the shaft portion, and the upper end portion of the shaft portion is crimped to outwardly extend over the upper surface of the bottom plate. A portion of the bottom plate of the adjustment rotor, fitted over the shaft portion, is located at a lower level than the uppermost edge of an inner portion of the through hole on the upper surface of the insulating substrate. Thus, the overall height of the chip type variable electronic-part is reduced with an increased insertion depth of a screwdriver into the rotor.

Chip type variable electronic part and chip type variable resistor

A chip resistor (A) comprises a first insulation layer (A) covering the regions between a plurality of electrodes () on a rear surface () of a resistor (), and a second insulation layer covering a pair of side faces of the resistor (). Inadvertent adhesion of solder to an improper part of the resistor () can thereby be eliminated. A solder layer () is preferably formed on a pair of end faces () of the resistor (). In so doing, a solder fillet can be formed appropriately.

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Kyoto, Japan

Tadatoshi Miwa