Asahi Kasei Kogyo Kabushiki Kaisha

Tadashi Taguchi

Mitsuo Kohno

Noboru Fujikawa

Kunio Satake

Katsumi Yoshitake

Toshihide Takemoto

A photopolymerizable element comprising a layer of a photopolymerizable composition and a liquid developer-soluble or -dispersible transparent oriented film support laminated onto one surface of the photopolymerizable composition layer is advantageously employed for the production of a polymeric image without stripping of the film support. The element may further comprise a strippable protective film provided on the other surface of the photopolymerizable composition layer. The element of this invention is useful especially for the production of photoresists which are advantageously used for the manufacture of printed circuit boards.

Photopolymerizable element comprising a soluble or dispersible oriented

A novel photopolymerizable composition comprising (a) a non-gaseous ethylenically unsaturated compound, (b) a thermoplastic organic polymer binder, (c) a photopolymerization initiator and (d) a specific s-triazine compound provides improved adhesion of a photopolymer prepared therefrom to a substrate even in aqueous plating or etching solutions.

Photopolymerizable composition containing s-triazine compound

A process for producing an image which comprises the steps of: (1) applying to the surface of a substrate the surface of a photosensitive layer, the other surface of the photosensitive layer being adhered to a substantially transparent film support which is soluble or dispersible in a developer consisting essentially of a liquid capable of substantially dissolving or dispersing therein the areas of the layer other than those having a polymeric image produced by imagewise exposure in the step (2) below; (2) exposing the photosensitive layer, imagewise, to actinic radiation to form a polymeric image in the layer; and (3) washing away with the developer the film support and the areas of the layer other than those having the polymeric image to form an image of a polymeric material on the substrate. The photosensitive element having on its one side the above-mentioned specific film support and the process have a variety of applications and are useful for producing photoresists which are advantageously used for making printed circuit boards.

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Kawasaki, Japan

Tadashi Taguchi