Matsushita Electric Industrial Co., Ltd.

Mitsubishi Petrochemical Company Limited

Tadashi Sakairi

Yasutomo Funakoshi

Tamotsu Wakahata

Kazuei Kenmochi

Seishi Terakado

Kazunori Ishii

Takafumi Asada

Takahiro Matsuo

Takao Inoue

Mitsutoshi Aritomi

Yoshio Maruyama

Sadao Watanabe

Tadao Takeyama

Nobuhisa Maeda

Masamitu Miyazaki

Kazuyoshi Shinohara

Kohji Hiya

Kanji Kiyohara

Fumio Iwami

Eizi Itemadani

Masamitsu Miyazaki

Kozo Suzuki

Mitsuru Itoh

A self-regulating heating article includes a first elongate layer formed by a crystalline polymeric composition of high crystallinity and conductive particles dispersed in the polymeric composition to exhibit a positive temperature coefficient of resistance. A pair of elongate electrodes, which are adapted for connection to a power supply, are secured one on each surface of the first layer to develop a potential in the direction of thickness of the first layer. The electrodes are arranged so that a creeping distance which is greater than the thickness of the first layer is established between the electrodes along peripheral edges thereof. The creeping distance prevents insulation breakdown and ensures safe, high wattage operation at power supply voltages.

Self-regulating heating article having electrodes directly connected to

A self-regulating heating article comprises a first elongate layer formed by a crystalline polymeric composition of high crystallinity and conductive particles dispersed in the polymeric composition to exhibit a positive temperature coefficient of resistance. A pair of elongate electrodes, which are adapted for connection to a mains supply, are secured one on each surface of the first layer to develop a potential in the direction of thickness of the first layer. The electrodes are arranged so that a creeping distance which is greater than the thickness of the first layer is established between the electrodes along peripheral edges thereof. The creeping distance prevents insulation breakdown and ensures safe, high wattage operation at mains voltages.

A method for producing a plastic substrate having Tg of 110.degree. C. or more is disclosed, which comprises radical polymerizing a polyfunctional (meth)acrylate compound in a mold by a cast molding method, removing the resulting substrate from the mold when the glass transition temperature of the substrate reaches 10.degree. to 100.degree. C., and then post-curing the substrate. The method of the present invention can provide high quality plastic substrates with high productivity.

Method for cast molding plastic substrate

A press molding apparatus and its method of operation for making an information carrier disc which comprises the steps of maintaining a mass of granular transparent synthetic material in a vacuum, radiating heat from an infrared heating unit to plasticize the synthetic material, and press-molding the plasticized synthetic material.

Method and press molding apparatus for forming information carrier discs

In an electronic parts carrier of the type comprising a bottom tape and a top tape for use with a chip-mounting machine, the top tape is arranged to be secured to the bottom tape so as to hold and sandwich each electronic parts chip between the lower surface of the top tape and a bottom of each recess made by the bottom tape. In one embodiment, the top tape is secured to the bottom tape by way of an adhesive where the depth of the recess is made slightly smaller than the height of the chips to be contained in the recess. In another embodiment, grooves are made in side walls of each recess so that convex portions made by the top tape are engageable with the grooves to secure the top tape with each electronic parts chip being held and sandwiched between the top tape and the bottom of each recess. A through-hole may be made in the bottom of the recess for easy recognition of the contained chips and for easy pushing up of the same when the chips are to be taken out of the carrier.

Electronic parts carrier with a chip-supporting top tape

A directly moldable resin composition for a composite plastic is disclosed, which comprises a predetermined amount of a mixture of pellets of a thermoplastic synthetic resin having an average size of 2.0 mm or larger and particles of a thermoplastic resin having an average size in a predetermined range, or particles of a thermoplastic resin alone having an average size of below 900 microns, and the balance of at least one filler such as particulate inorganic fillers or fibrous fillers. The particles of a thermoplastic resin should preferably be contained in an amount equal to or higher than 100% by volume of the at least one filler. When determined by a suspending tensile failure method at a tension speed of 2 mm/cm.sup.2, a particulate filler should preferably have an adhesion force in the range of below 4 g/cm.sup.2. Greater amounts of the mixture or the particles of thermoplastic resins can be used when the filler is treated on the surface thereof with organic compounds with a H.L.B. value below 13 so as to improve affinity for synthetic resins.

Directly moldable resin compositions for composite plastics

A combined molding and assembling apparatus which comprises a conveyor movable from one position to another position spaced apart from such one position, a pallet frictionally engageable with the conveyor for movement together therewith, a catch mechanism releaseably engageable with the pallet to hold the pallet at a working position, a molding machine fixedly mounted on a bench of the apparatus adjacent the conveyor and including a movable plate movable in a direction perpendicular to the direction of movement of the conveyor means for selectively closing and opening a mold assembly, and a handling machine including a head capable of moving selectively into and away from the space, in which the mold assembly operates, during the opening of the mold assembly.

Combined molding and assembling apparatus

Composition is characterized in that ethylenically unsaturated group (CH.sub.2 .dbd.C&lt;) operation is performed, under the existence of dispersion agent and antioxidant, to polyolefin series composition, and at least one kind of epoxy group and amino group is filler-graft-bonded with olefin through organic peroxide.

Polyolefin series composition comprising surface treatment of filler and

A method of making a keyboard including, a number of switch keys fixedly provided on one surface of a resilient plastic sheet a number of moving contacts formed on the other surface of the resilient plastic sheet. The keys are formed of a plastic material having a melting temperature lower than that of the resilient plastic sheet. Thermoplastic bond layers are deposited on both surfaces of the resilient plastic sheet. The melting point of the thermoplastic bond layers is lower than that of the switch keys. The resilient plastic sheet is placed in a metal mold which has cavities (101a) at predetermined places. Melted plastic material is injected into the cavities to form the switch keys and at the same time cause the portions of thermoplastic bond layers which contact the injected melted plastic to be melted by the heat of the injected melted plastic material and to bond the switch keys onto the resilient plastic sheet.

Method of making keyboard switches

A magnet device having magnetic poles of opposite polarities on the same surface comprises a plurality of plastic matix magnet elements providing a magnetic circuit arranged to concentrate the magnetic energy of the magnet elements so as to derive a great magnetic force from the magnetic poles.

Growing community of inventors

Katano, Japan

Tadashi Sakairi