Ngk Insulators, Inc.

Soshin Electric Co., Ltd.

Tadashi Otagiri

Go Suzuki

Yoshinori Ide

Tomoyuki Hasegawa

Tomio Suzuki

Takeshi Oobuchi

Yukio Isowaki

Makoto Ohmori

Hirofumi Yamaguchi

Syunzo Mase

Toshikatsu Kashiwaya

Takashi Ryu

Tetsuo Watanabe

Shuhei Ishikawa

Hisayoshi Nonaka

Masahiro Shirai

Hiroyuki Maruta

Toshiaki Kuno

Yuji Umeda

Yuhji Umeda

Satoru Kawai

Yoshitaka Tabuchi

Takashi Nagatomo

Minoru Ohara

Yui Kumura

On each of upper and lower surfaces of a flat-plate-like support substrate having a longitudinal direction and having fuel gas flow channels formed therein, a plurality of power-generating elements A connected electrically in series are disposed at predetermined intervals along the longitudinal direction. On each of the upper and lower surfaces of the support substrate, a plurality of recesses are formed at predetermined intervals along the longitudinal direction. Each of the recesses is a rectangular-parallelepiped-like depression defined by four side walls arranged in a circumferentially closed manner and a bottom wall. That is, in the support substrate, frames are formed to surround the respective recesses. Fuel electrodes of the power-generating elements A are embedded in the respective recesses.

Structure of solid oxide fuel cell

It is provided a composite electronic part having magnetic material and dielectric material and made by co-sintering at a temperature of 1000&#xb0; C. or lower. The magnetic material comprises a ferrite comprising 46 to 48 mol % of FeO, 0.1 to 36 mol % of ZnO, 10 to 14 mol % of CuO and the balance being NiO. The dielectric material has a dielectric constant of 1000 or higher, and comprises a barium titanate based dielectric material to which 0.5 to 4.0 weight parts of CuO and 4.0 to 9.0 weight parts of BiOare added with respect to 100 weight parts of the barium titanate based dielectric material.

Composite electronic parts

A ferrite material and an electronic component which employs sintered ferrite formed from the ferrite material. The ferrite material is obtained by adding, as minor ingredients, 0.06-0.50 parts by weight of bismuth oxide in terms of Bi2O3, 0.11-0.90 parts by weight of titanium oxide in terms of TiO2, and 0.06-0.46 parts by weight of barium oxide in terms of BaO to a ferrite powder comprising iron oxide, copper oxide, zinc oxide, and nickel oxide as major ingredients. The weight ratio among the bismuth oxide, the titanium oxide, and the barium oxide is as follows: when the proportion of the bismuth oxide in terms of Bi2O3 is taken as 1.00, then the proportion of the titanium oxide in terms of TiO2 is 1.08-2.72 and that of the barium oxide in terms of BaO is 0.72-1.20.

Ferrite material and electronic component

It is provided a ceramic multilayer substrate obtained by co-sintering a low dielectric constant layer made of an insulating material of a low dielectric constant and a high dielectric constant layer of a dielectric material of a high dielectric constant. The low dielectric constant layer includes a ceramic component of xBaO-yTiO-zZnO ('x', 'y' and &#x201c;z&#x201d; represent molar ratios, respectively, and satisfy the relationship: x+y+z=1; 0.09&#x2266;x&#x2266;0.20; 0.49&#x2266;y&#x2266;0.61; 0.19&#x2266;z&#x2266;0.42) and 1.0 to 5.0 weight parts of a glass component comprising boron oxide with respect to 100 weight parts of the ceramic component. The high dielectric layer is made of a barium titanate based dielectric material with CuO and BiOadded thereto.

Ceramic multilayer substrate

The present invention provides a dielectric porcelain composition comprising 100 parts by weight of a barium titanate-based dielectric material and 4 to 10 parts by weight in total of BiOand at least one compound selected from the group of consisting of CuO, ZnO and MgO.

Dielectric porcelain composition and electronic component

0.5 to 30 parts by weight of a hexagonal celsian powder is added to 100 parts by weight of a ceramic raw material powder to give a mixture. The mixture is sintered to give a ceramic porcelain so as to precipitate monoclinic celsian in the ceramic porcelain.

Process for production of ceramic porcelains, ceramic procelains and electronic components

A dielectric composition for firing at a low temperature having a high dielectric constant &#x3b5;r, a high Q value, and a low temperature coefficient &#x3c4;f of the resonance frequency is provided. The dielectric composition includes a main composition of x.BaO-y.TiO-z1.NdO-z2.LaO-z3.SmO-t.BiO, (x+y+z1+z2+z3+t=1, 0.070&#x2266;x&#x2266;0.300, 0.385&#x2266;y&#x2266;0.844, 0.010&#x2266;z1&#x2266;0.130, 0.000&#x2266;z2&#x2266;0.120, 0.000&#x2266;z3&#x2266;0.120, and 0.075&#x3c;t&#x2266;0.185). The dielectric composition also includes a glass component containing at least 0.1 weight percent or more of BOin an amount of 0.05 to 20 weight parts with respect to 100 weight parts of the main composition.

Dielectric compositions for firing at low temperatures and electronic parts

There is provided a substrate material for wiring having an excellent thermal resistance, and durability and reliability under severe conditions, characterized in that said substrate material comprises an insulator whose major component is composed of epoxy resin and ceramics having a thermal expansion coefficient of 2 ppm/&deg; C. or less, and that the thermal expansion coefficient is isotropic.

Substrate material for wiring and substrate material for printed circuit using the same

A substrate material ( ) for printed circuit, comprising a sheet-shaped composite material ( ) composed of a plastic and a ceramic and conductive metal wires ( ) fixed in the composite material ( ) at given pitches, wherein the two surfaces of the substrate material ( ) have electrical connection to each other via the metal wires ( ). A process for producing a substrate material for printed circuit, which comprises stretching, in a mold, conductive metal wires at given pitches, then pouring, into the mold, a composite material composed of a plastic and a ceramic, curing the composite material, thereafter slicing the resulting material in a direction approximately perpendicular to the direction of the metal wires. Good electrical connection can be secured, and it is possible to prevent, during use, peeling between substrate material and conductive layers and between insulating material and metal wires. A printed circuit board of high density and excellent dimensional accuracy can be obtained.

Printed circuit board material and method of manufacturing board material and intermediate block body for board material

The present invention includes the following three types of piezoelectric porcelains. (1) In a piezoelectric porcelain having a composition of aPb[Mg.sub.1-X Ni.sub.X).sub.1/3 (Nb.sub.1-Y Ta.sub.Y).sub.2/3 ]O.sub.3 -bPbTiO.sub.3 -cPbZrO.sub.3, the coefficients a, b and c (mol %) and the substitution rate X satisfy all the following conditions; 15.ltoreq.a.ltoreq.45, 32.ltoreq.b.ltoreq.45, 10.ltoreq.c.ltoreq.50 and 0.1.ltoreq.X.ltoreq.0.9. (2) In a piezoelectric porcelain having a composition of aPb[Mg.sub.1-X Ni.sub.X).sub.1/3 (Nb.sub.1-Y Ta.sub.Y).sub.2/3 ]O.sub.3 -bPbTiO.sub.3 -cPbZrO.sub.3, the coefficients a, b and c (mol %) and the substitution rates X and Y satisfy all the following conditions; 15.ltoreq.a.ltoreq.45, 32.ltoreq.b.ltoreq.45, 10.ltoreq.c.ltoreq.50, 0.1.ltoreq.X.ltoreq.0.9, 0.1.ltoreq.Y.ltoreq.0.9 and Y-X.gtoreq.0.05. (3) In a piezoelectric porcelain having a composition of aPb[Mg.sub.1-X Ni.sub.X).sub.1/3 (Nb.sub.1-Y Ta.sub.Y).sub.2/3 ]O.sub.3 -bPbTiO.sub.3 -cPbZrO.sub.3, the coefficients a, b and c (mol %) and the substitution rates X and Y satisfy all the following conditions; 15.ltoreq.a.ltoreq.45, 32.ltoreq.b.ltoreq.45, 10.ltoreq.c.ltoreq.50, 0.2.ltoreq.X.ltoreq.0.9, 0.2.ltoreq.Y.ltoreq.0.9 and X-Y.gtoreq.0.05.

Piezoelectric porcelain

In a ceramic joined body wherein a first metalizing layer formed on a surface of an aluminum nitride member on which semiconductor elements are installed and a second metalizing layer formed on a surface of an insulation substrate fireable at low temperatures are joined with each other via a solder used at high temperatures, an intermediate layer including a predetermined metal component and a predetermined glass component is arranged between the insulation substrate and the second metalizing layer. The glass component is melted into the insulation substrate during the firing operation, and thus a sufficient connection strength between the insulation substrate and the aluminum nitride member can be obtained. Moreover, the metal component and the glass component function to make the thermal expansion coefficient an intermediate value between the insulation substrate and the first metalizing layer, and thus heat stress generated during the brazing operation can be eliminated.

Ceramic joined body

In a multilayered ceramic substrate having a ceramic substrate fireable in low temperatures and a metal member for input/output brazed to the ceramic substrate, an intermediate layer including a ceramic component is arranged between the ceramic substrate and the metal member in such a manner that thermal coefficients .alpha..sub.1, .alpha..sub.2 and .alpha..sub.3 between a room temperature and near a brazing temperature of the metal member, the ceramic component in the intermediate layer and the ceramic layer, respectively, maintains a relation of .alpha..sub.1 &gt;.alpha..sub.2 &gt;.alpha..sub.3. Moreover, the ceramic substrate fireable in low temperatures is constructed by first ceramic layer having a flexural strength more than 25 kg/mm.sup.2 and a second ceramic layer having a dielectric constant less than 7. In these constructions, the multilayered ceramic substrate having a sufficient adhesion strength between the metal member and the ceramic substrate and a good reliability can be obtained, while advantages of the ceramic substrate fireable in low temperatures can be maintained.

Multilayered ceramic substrate fireable in low temperature

A ceramic green sheet comprises a green sheet as a core and a surface layer formed thereon. Such ceramic green sheets are laminated for use in IC package, printed circuit board or the like.

Ceramic green sheets

Zirconia ceramics consisting mainly of ZrO.sub.2 and Y.sub.2 O.sub.3 in a molar ratio of Y.sub.2 O.sub.3 /ZrO.sub.2 of 2/98.about.7/93 and consisting of crystal grains having a mixed phase consisting essentially of tetragonal phase and cubic phase or having a phase consisting essentially of tetragonal phase, the average size of the crystal grains being not larger than 2 .mu.m, has a high strength and shows little deterioration of strength due to the lapse of time, and is suitable as a solid electrolyte for oxygen concentration cells, machine parts for internal combustion engines, thermistors, cutting tools and other industrial materials.

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Nagoya, Japan

Tadashi Otagiri