Matsushita Electric Industrial Co., Ltd.

Sharp Kabushiki Kaisha Corporation

Panasonic Corporation

Kubota Corporation

Canon Kabushiki Kaisha

Panasonic Intellectual Property Management Co., Ltd.

Canon Denshi Kabushiki Kaisha

Tadashi Nakamura

Yasumori Hino

Fumio Echigo

Masafumi Shimotashiro

Norio Miyatake

Masanori Itoh

Hideki Higashitani

Daizo Andoh

Yasuharu Morinishi

Toshihisa Ishida

Satoshi Ogawa

Yoshiaki Akazawa

Yasuhiro Nakatani

Hitoshi Nagahama

Masanori Ito

Masahide Tsukamoto

Yoshihiro Kawakita

Masayuki Sakamoto

Nobuhiko Nakano

Hiroshi Tojo

Masahiro Birukawa

Hidetomo Sohma

Junichi Saito

Satoshi Katayama

Mikio Kakui

Tousaku Nishiyama

Masaaki Katsumata

Shozo Ochi

Takahiro Bito

Tadayuki Sawai

Yoshihide Shimoda

Tomoko Kanazawa

Yoshiho Gotoh

Yoshihisa Yamashita

Takeshi Suzuki

Yasuhiro Shibai

Toshiyuki Matsumoto

Kiyoshi Toizumi

Satoru Tomekawa

Kenzo Ushiro

Kentaro Tanikawa

Shougo Iwai

Genichi Funabashi

Kunihiko Nishino

Kazushige Morita

Megumi Sawai

Toshihiko Murakami

Yoshinori Urata

Toshio Sugawa

Makoto Mitsuda

Daizou Andou

Tatsuhiro Morita

Shogo Hirai

Kazuya Maeda

Takayuki Kita

Kota Fukasawa

Takeaki Ohuchi

Yoshiaki Takahashi

Tatsuo Imafuku

Yoji Ueda

Akira Teraoka

Sayaka Fujita

Shinji Umeda

Kunihiko Oishi

Hirofumi Sakita

Nobuyasu Honda

Akihiko Kawahara

Norita Tottori

Satoshi Yamaue

Hiroki Fukudome

Shigeo Shoen

Misako Kawai

Kanshiro Okamoto

Daizo Ando

Noritake Fukuda

Tatuo Imafuku

Takeaki Ouchi

Osamu Okauchi

Katsuaki Sumida

Makoto Kurokawa

Hironobu Nogami

Yasuo Kitabatake

Katsumi Yanagihara

Hirofumi Iritani

Yuichiro Takesue

Kiyoshige Maezawa

Kazuhiko Honjo

Hideaki Ezaki

Kenkichi Hirakawa

Hiroko Ishibashi

Yoshihiro Taniike

Nobuyuki Yoshii

Eiichi Ishida

Takahiro Komine

Sadayuki Kaneko

Shigeaki Tasaka

Satoru Yamanaka

Shinsuke Kashiyama

Teizo Takahashi

Masafumi Oshita

A work vehicle includes a hood swingable in an up-down direction between an open position, in which the hood is positioned expose an engine room, and a closed position, in which the hood is positioned to close the engine room, and at least one damper to urge the hood toward a side of the open position. The damper is swingable in the up-down direction to rise toward a standing position in response to the hood being swung from a position closer to the closed position toward a position closer to the open position and fall toward a lying position in response to the hood being swung from the position closer to the open position to the position closer to the closed position. An urging mechanism is provided to, while the damper is in a position closer to the lying position than an intermediate position, apply to the hood an urging force to urge the hood from the position closer to the closed position toward the position closer to the open position against the load of the hood.

Work vehicle

In a case where feeding of a subsequent sheet by a feed roller is started after the trailing edge of a preceding sheet is detected by a post-registration sensor, a control unit of a sheet feeder controls the feed roller to rotate at a first feeding speed, and in a case where the leading edge of the subsequent sheet has passed through a nip position between the feed roller and a separation roller, the control unit controls the feed roller to rotate at a second feeding speed.

Sheet feeder, control method of sheet feeder, and storage medium

An operating mechanism of a work vehicle includes: an operating portion that is provided to a side console disposed beside a seat and can be operated by an operator; and a switching portion capable of switching between a used state in which the operating portion can be used and a non-used state in which the operating portion cannot be used.

Operating mechanism of work vehicle

A playback device includes a first communicator that communicates with a terminal device through a first communication scheme and that receives music data and music information indicating an attribute of the music data from the terminal device, a music information storage that stores the music information received by the first communicator, a music player that plays back the music data received by the first communicator, a search processor that generates search data for searching for information related to the music data based on the music information, and a second communicator that communicates via a network through a second communication scheme different from the first communication scheme and that transmits the search data and receives a search result for the search data. The search processor outputs the search result received by the second communicator.

Playback device and method of controlling the same

A device for measuring adhesion of toner to carrier containing a magnetic component, the toner and the carrier being contained in a two-component developer, includes: a developer holding section including a first magnet for holding the two-component developer by a magnetic force; an airflow supply section for supplying airflow to the two-component developer held by the first magnet; a separated toner detecting section for detecting the number of toner separated from the carrier by the airflow; and an adhesion calculating section for calculating the adhesion of the toner to the carrier or an index of the adhesion, based on wind speed of the airflow and the detected number of the separated toner. Thus, the device can measure the adhesion of the toner to the carrier with high reproducibility and exactness.

Device and method for measuring toner adhesion

An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured.

Circuit board and manufacturing method thereof

A multilayer printed wiring board () is composed of a plurality of printed wiring boards (and) each having wiring on its both sides, and a relaxing connection layer () for interconnecting the printed wiring boards (and). The relaxing connection layer () contains an inorganic filler, a thermosetting resin, and a reliever for relieving internal stress. The multilayer printed wiring board () is prevented from warpage by making the relaxing connection layer () disposed inside it absorb internal stress caused by heating and cooling in a solder reflow process or other processes.

Multilayer printed wiring board and mounting body using the same

The present invention provides an AV data recording apparatus and method that facilitate various processes concerning a recorded video, including continuous reproduction, digital transmission, file operation, partial deletion, and post-recording. The AV data recording apparatus divides an audio signal and a video signal into transport packets having a predetermined unit length, assembles a plurality of transport packets as one transport stream and executes recording. Accordingly, this invention enables managing whether a logical block is used or not, detecting a continuous data area comprising plural logical blocks that ensure realtime continuous reproduction, and determining logical block numbers of continuous data areas to be recorded. As a result, the transport stream is recorded continuously on a plurality of detected continuous data areas.

AV data recording apparatus and method, disk recorded with the AV data recording apparatus or method, and AV data reproducing apparatus and method

A three-dimensional circuit board includes a lower substrate, a connection layer provided on an upper surface of the lower substrate, and an upper substrate provided on an upper surface of the connection layer. The connection layer exposes a portion of the upper surface of the lower substrate. The connection layer includes an insulating layer having a through-hole, and a via-conductor made of conductive material filling the through-hole. A recess is provided directly above the portion of the upper surface of the lower substrate and is surrounded by a side surface of the upper substrate and a side surface of the connection layer. A portion of the upper surface of the connection layer connected to the side surface of the connection layer inclines in a direction toward the portion of the upper surface of the lower substrate. The portion of the upper surface of the connection layer is provided from the side surface of the connection layer to the via-conductor. A portion of an upper substrate of the upper substrate connected to the side surface of the upper substrate inclines in a direction toward the portion of the upper surface of the lower substrate. The circuit board allows a component to be mounted in the recess efficiently.

Three-dimensional wiring board

A drive apparatus of the present invention includes: a recording/reproduction section and a drive control section. The drive control section performs a process including: receiving a recording instruction including a location at which data is to be recorded; determining a track among at least one tracks corresponding to the location included in the recording instruction; controlling the recording/reproduction section to record data at a replacement location in the user data area instead of the location included in the recording instruction; determining whether or not the recording of the data at the replacement location in the user data area has succeeded; and when the recording of the data at the replacement location in the user data area has failed, controlling the recording/reproduction section to record the data at a location in the spare area.

Drive device

A lower sub-board of a circuit board includes a first base layer having an upper surface, and a first wiring pattern provided on the upper surface of the first base layer. An upper sub-board of a circuit board includes a second base layer having a lower surface, and a second wiring pattern provided on the lower surface of the second base layer. A connection layer between lower and upper sub-boards includes an insulating layer having a lower surface and an upper surface, the lower surface of connection layer being situated on the upper surface of the first base layer, the upper surface of connection layer being situated on the lower surface of the second base layer, and a via-conductor passing through the insulating layer and connected to the first and second wiring patterns. This circuit board connects the sub-boards to each other via a via-conductor densely.

Circuit board with connection layer with fillet

The drive apparatus of the present invention includes a recording/reproduction section and a drive control section. The drive control section determines a physical address indicating a location at which data can be recorded next in the determined track of a write-once recording medium as a next writable address, based on the last recorded address in the track; compares the physical address corresponding to the logical address included in the recording instruction with the next writable address; when the physical address corresponding to the logical address is smaller than the next writable address, controls the recording/reproduction section to record the data at a specific location in the user data area other than the location indicated by the physical address corresponding to the logical address in the recording instruction; generates new disc management information; and controls the recording/reproduction section to record the new disc management information in the disc management information area.

Drive apparatus for performing a sequential recording and reproduction on a write-once recording medium, and method of reproducing same

A solid printed circuit board is manufactured by bonding upper and lower printed circuit boards having different shapes and provided with wirings formed on surfaces thereof. A bonding layer is made of insulating material containing thermosetting resin and inorganic filler dispersed therein, and has a via-conductor made of conductive paste filling a through-hole perforated in a predetermined position of the bonding layer. This circuit board provides a packaging configuration achieving small size and thickness and three-dimensional mounting suitable for semiconductors of high performance and multiple-pin structure.

Solid printed circuit board and method of manufacturing the same

A drive apparatus of the present invention includes a recording/reproduction section and a drive control section. The drive control section performs a process including: determining a first track of the plurality of tracks, based on the physical address corresponding to the logical address included in the recording instruction and the track management information; determining whether or not the first track is a closed track; when the first track is determined to be the closed track, performing a process including: determining a second track different from the first track, the second track being an open track; determining as a next writable address a physical address indicating a location at which data can be recorded next in the second track, based on the last recorded address in the second track; pseudo-overwrite recording the data at the next writable address as a replacement location.

Drive apparatus for recording a write-once medium

A multilayer wiring board employs a thin insulating substrate having substantially only resin flow as the compression property effect, and has an any-layer IVH structure where at least one core layer is formed without burying wiring. For sufficiently securing an effective compression amount of the crush-allowance of a conductor, the ratio of the thickness of a cover film to that of the electrical insulating substrate is increased, and a via can be formed in the core layer without burying the wiring in the insulating substrate. Thus, a multilayer wiring board having an any-layer IVH structure that can achieve high-density component mountability and wiring storability in an extremely small thickness can be provided.

Multilayer wiring board and its manufacturing method

Growing community of inventors

Nara, Japan

Tadashi Nakamura