Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Tadashi Maeda

Tadahiko Sakai

Hiroki Maruo

Tsubasa Saeki

Mitsuru Ozono

Yuki Yoshioka

Shingo Okamura

Masayuki Mantani

Arata Kishi

Takayoshi Yamaguchi

Yosuke Wada

An adhesive for temporarily fixing an electronic component to a solder precoat covered at least partially with an organic film, the adhesive including a principal resin, and a solvent dissolving the principal resin. The content of the solvent is 25 mass % or more and 40 mass % or less, and the organic film dissolves in the solvent when the solder precoat is melted. According thereto, the formation of an oxide film on the surface of the solder precoat can be suppressed, and poor connection between the electrode having the solder precoat and the electronic component can be suppressed.

Adhesive for provisionally fixing electronic component to solder precoat and method for producing electronic component mounted substrate

A mounting substrate manufacturing method for soldering a terminal of an electronic component to a landof a substrateincludes: a paste disposing step of disposing a solder paste on the land; a melting and solidifying step of melting and solidifying the solder paste, to form a precoated areacoated with solder, on the land; a breaking step of breaking a residue covering a surface of the precoated areaby pressing a toolagainst the precoated area; a flux disposing step of disposing a flux F on the precoated area; a component placement step of placing an electronic component on the substrate, with the terminal of the electronic component aligned with the precoated area; and a reflow step of heating the substrateto melt the precoated area, to solder the terminal to the land. This can provide a mounting substrate manufacturing method that can reduce the occurrence of soldering defects.

Mounting board manufacturing method and flux coating device

A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film () in such a manner as to cover a plurality of solder precoats () formed on a plurality of lands () on a substrate and an antioxidation film () formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components () on the plurality of solder precoats () via the antioxidation film () and the temporary fixing film (); and a step (iii) of soldering the plurality of electronic components () to the lands () by melting the plurality of solder precoats (). The antioxidation film () contains a first thermoplastic resin. The temporary fixing film () contains an activating agent and a second thermoplastic resin. The softening point of the first thermoplastic resin is equal to or lower than the softening point of the second thermoplastic resin.

Method for producing electronic component mounted substrate

A filtering medium includes a nonwoven fabric and a first electrode having an input terminal of power. The first electrode is provided on a surface of the nonwoven fabric. Alternatively, in a case where the nonwoven fabric has a plurality of fiber layers, the first electrode may be provided between the fiber layers. An air purifier includes the filtering medium disposed between a sucker and a discharger of a gas, and an output terminal via which power is output to the first electrode of the filtering medium.

Filtering medium and air purifier

A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.

Connection structure of circuit member, connection method, and connection material

Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a screen printing machine for applying solder paste to the substrate; a resin dispensing machine arranged downstream of the screen printing machine, for dispensing a thermosetting resin onto at least one reinforcement position on the substrate; a second electronic component placement machine arranged adjacent to and downstream of the resin dispensing machine, for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the resin; a first electronic component placement machine arranged downstream of the second electronic component placement machine, for placing a first electronic component on the substrate; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant.

Electronic component mounting line and electronic component mounting method

Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine for feeding the substrate; a screen printing machine for applying solder paste to the substrate; a first electronic component placement machine for placing a first electronic component on the substrate; a resin dispensing machine for dispensing a thermosetting resin onto at least one reinforcement position arranged on the substrate; a second electronic component placement machine for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the thermosetting resin; and a reflow machine for bonding the first and second electronic components to the substrate, by heating and cooling the resultant. The second electronic component placement machine is arranged adjacent to and downstream of the resin dispensing machine.

There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation. Such flux which is placed between a solder portion formed on a first electrode and a second electrode when the first electrode is soldered to the second electrode contains:

Flux for soldering and soldering process

Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a printing machine for applying solder paste to a first placement area of the substrate; a first electronic component placement machine for placing a first electronic component on the first placement area; a second electronic component placement machine for dispensing a thermosetting resin onto a reinforcement position on a peripheral edge portion of a second placement area of the substrate, and for placing on the area the second electronic component having solder bumps; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant. The second electronic component is placed after the resin is dispensed, such that a peripheral edge portion thereof comes in contact with the resin.

In the soldering method, metal-powder-contained flux is disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprising a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.

Paste for soldering and soldering method using the same

In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powderis mixed into flux employed so as to intervene between a bump and an electrode. The metallic powderhas a flake or dendrite shape including a core segmentof the metal molten at a higher temperature than the liquid phase temperature of solder constituting a solder bump and a surface segmentof the metal with good-wettability for the molten solder and to be solid-solved in the core segmentmolten. In the heating by the re-flow, the metallic powder remaining in the flux without being taken in a solder portion is molten and solidified to become substantially spherical metallic particlesThus, after the re-flow, the metallic powder does not remain in a flux residue in a state where migration is likely to occur, thereby combining both solder connectivity and insurance of insulation.

Method for soldering electronic component and soldering structure of electronic component

A method of soldering electronic component () having solder bumps () formed thereon to substrate (), wherein bumps () are pressed against a flux transferring stage on which a thin film is formed of flux () containing metal powder () of good wettability to solder so as to cause metal powder () to penetrate oxide films () and embed in the surfaces on the bottom parts of bumps (), and bumps () in this state are positioned and mounted to electrodes () on substrate (). Substrate () is then heated to melt bumps () and allow the melted solder to flow and spread along the surfaces of metal powder () toward electrodes (). The method can thus provide solder bonding portions of high quality without any soldering defect and deterioration of the insulating property.

Method of soldering electronic component having solder bumps to substrate

A semiconductor device having a thinned semiconductor element that can be easily handled is manufactured with a method of manufacturing. The semiconductor device includes a semiconductor element and a bumper member bonded, as a reinforcing member, to a back surface opposite to an electrode-formed surface of the semiconductor element with an adhesive. The adhesive has a low elastic modulus and easily expands and contracts after bonding, and bonds the semiconductor element to the bumper member while allowing the semiconductor element to be deformed. Thus, the semiconductor device can be easily handled, and the semiconductor element can be deformed in response to the deformation of a substrate after being mounted. In addition, a thermal stress in a heat cycle can be alleviated effectively.

Semiconductor device, method of manufacturing the device and method of mounting the device

A solder bump formation method and solder bump mounting method for forming a solder bump by soldering a solder ball,onto an electrode,provided at the bottom of a cavity,on a substrate,which has an opening shape through which the solder ball,cannot go. Metal paste,containing metal having a higher liquidus temperature than that of solder used for the solder ball,is filled into the cavity,The solder ball,is placed on the cavity,, and then heated to the temperature higher than the liquidus temperature of the solder ball,During the heating process, metal in the metal paste,remains unmelted in the cavity,when the solder ball,melts. This enables the metal to direct the melted solder to the electrode,at the bottom of the cavity,achieving good soldering.

Growing community of inventors

Yamanashi, Japan

Tadashi Maeda