Canon Kabushiki Kaisha

Tadashi Kosaka

Koji Tsuduki

Shin Hasegawa

Takanori Suzuki

Hisatane Komori

Yasuhiro Matsuki

Fujio Ito

Kazuya Notsu

Yu Katase

Yasushi Kurihara

Ichiro Kataoka

Koichi Shimizu

Akiya Nakayama

Shuichi Chiba

Satoru Hamasaki

Ikuto Kimura

Hiroshi Kondo

Akio Atsuta

Masahiko Igaki

Makoto Ogura

Takahiro Hachisu

Fumio Hata

Takao Toyooka

Yoshifumi Murakami

Provided is an electronic device that suppresses an increase in internal pressure while suppressing entry of a foreign material. An electronic module according to the present embodiment has an electronic device, a substrate, a frame, and a cover, a hole portion having a first opening in a first main surface and a second opening in a second main surface and communicating the internal space and the external space, and a component is disposed to face the second opening.

Electronic module and imaging system

According to the disclosure, a relationship of Tgp&#x3e;Tgf, &#x3b1;f1&#x3c;&#x3b1;PCB1, and (Tgp&#x2212;To)&#xd7;&#x3b1;PCB1&#x3c;(Tgf&#x2212;To)&#xd7;&#x3b1;f1+(Tgp&#x2212;Tgf)&#xd7;&#x3b1;f2 or a relationship of Tgp&#x3c;Tgf, &#x3b1;PCB1&#x3c;&#x3b1;f1, and (Tgf&#x2212;To)&#xd7;&#x3b1;f1&#x3c;(Tgp&#x2212;To)&#xd7;&#x3b1;PCB1+(Tgf&#x2212;Tgp)&#xd7;&#x3b1;PCB2 is satisfied, where linear expansion coefficients in an in-plane direction of the substrate at a temperature below a glass transition temperature Tgp of the substrate and at a temperature above the glass transition temperature Tgp of the substrate are denoted as &#x3b1;PCB1 and &#x3b1;PCB2, respectively, linear expansion coefficient of the frame at a temperature below a glass transition temperature Tgf of the frame and at a temperature above the glass transition temperature Tgf of the frame are denoted as &#x3b1;f1 and &#x3b1;f2, respectively, and a room temperature is denoted as To.

Imaging device module, imaging system, imaging device package, and manufacturing method

Provided is an electronic component including: a base member; an electronic device fixed on the base member; and a lid member arranged over the electronic device and fixed on the base member. A primary material of the lid member is a crystal quartz, the lid member has two primary faces opposing to the electronic device and four side faces, and each of the four side faces is a wet-etched face that is not parallel to an optical axis of the crystal quartz.

Electronic component, manufacturing method of electronic component, and electronic equipment

A module, comprising an electronic component having a first electrode, a mounting board having a second electrode, a solder-bump configured to connect the first electrode and the second electrode, and a thermoplastic resin member configured to contact both the first electrode and the second electrode and cover the solder-bump, so as to form a space between the electronic component and the mounting board.

Module, method for manufacturing the same, and electronic device

A package includes an insulating member, first electrically conductive members, and a second electrically conductive member. Each of the first electrically conductive members includes a first terminal portion that forms a part of a first surface, and a second terminal portion that is positioned on a side of a side surface with respect to the first terminal portion and forms a part of the side surface. The second electrically conductive member includes an embedded portion embedded in the insulating member, third terminal portions each of which forms a part of the first surface and is connected to the embedded portion, and a fourth terminal portion that forms a part of a second surface and is connected to the embedded portion.

Package, electronic component, and electronic apparatus

A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.

Method for producing a module

An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover.

Electronic component, electronic apparatus, and method for manufacturing the electronic component

A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.

Electronic component and electronic apparatus

A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition &#x3b1;, &#x3b1;, &#x3b1;&#x3c;&#x3b1;is satisfied, where &#x3b1;is a thermal expansion coefficient of the lid body, &#x3b1;is a thermal expansion coefficient of the frame body, &#x3b1;is a thermal expansion coefficient of the base body, and &#x3b1;is a thermal expansion coefficient of the wiring member.

Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus

A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.

Electronic component, mounting member, electronic apparatus, and their manufacturing methods

An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.

Image pickup module with improved flatness of image sensor and via electrodes

A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting &#x3b1; rays, an amount of the &#x3b1; rays being smaller than or equal to 0.05 c/cm&#xb7;h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.

Method of manufacturing optical sensor, optical sensor, and camera including optical sensor

A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.

Method of manufacturing optical sensor

To provide a package for an optical semiconductor having a light-emitting device and a light-receiving device in one package, in which a groove is provided between the light-emitting device and the light-receiving device to thereby avoid rays of light from the light-emitting device to directly enter the light-receiving device.

Package for optical semiconductor

An IC package has a substrate having recesses formed on the side wall thereof, an insulating film for covering an opening of each recess on the side of a principal surface of the substrate, and an IC chip mounted on a mount surface side of the film on the substrate, wherein a conductive portion formed on each recess is used as an external connection terminal for the IC chip. A method of assembling an IC package has the steps of forming a substrate having a plurality of through holes each having an insulating film covering one of the openings of each through hole, mounting one or more IC chips on a principal surface of the substrate on the insulating film side, and electrically connecting the IC chip and the through holes, sealing the substrate with the IC chip mounted thereon with insulating resin, and cut the substrate with the IC chip mounted thereon to expose the side wall of each through hole.

Growing community of inventors

Atsugi, Japan

Tadashi Kosaka