Murata Manufacturing Co., Ltd.

Tadashi Kani

Makoto Fujita

Toshikazu Funahara

Akiyoshi Moriyasu

Tsutomu Ieki

Satoru Noda

Makoto Kawagishi

A component incorporating module includes an insulation resin layer, a plurality of lands arranged to mount components and wiring patterns connected to the plurality of lands, which are arranged along a first main surface of the resin layer, and circuit components connected to the lands to mount components. The circuit components are embedded in the resin layer. The plurality of lands have thicknesses that are greater than those of the wiring patterns adjacent to the corresponding lands.

Component incorporating module

A quartz oscillator is constructed to achieve a better yield when being mass-produced, by providing a margin of strength for each of the substrates thereof while reducing the thickness of the quartz oscillator devices. A box-shaped circuit substrate is provided for mounting thereon circuit components having different heights from one another. The bottom plate of a recess in this circuit substrate has a level difference, and is constituted of a region where the thickness of the bottom plate is relatively larger and a region where the thickness of the bottom plate is relatively smaller. High-profile circuit components are mounted on the region where the thickness of the bottom plate is smaller, while low-profile components are mounted on the region where the thickness of the bottom plate is larger. By thus increasing the thickness of one portion of the bottom plate of the circuit substrate, the bending strength of the circuit substrate is improved.

Electronic component module and piezoelectric oscillator device

A compact quartz oscillator includes a quartz vibrator that is integrally mounted on a circuit substrate. In the quartz oscillator, flux residue can be easily washed away. A cavity is defined in the approximate center of the circuit substrate. Within the cavity, circuit components defining an oscillation circuit, a temperature-compensating circuit, and other such circuits are surface-mounted preferably via reflow soldering. Connection electrodes are disposed at the four corners of walls surrounding the cavity. The connection electrodes are bonded to electrodes of the quartz vibrator mounted on the circuit substrate preferably via reflow soldering. Recesses are provided in the top surfaces of the walls. With the recesses, clearances are created between the circuit substrate and the quartz vibrator. As a result, in order to wash away flux residue.

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Kyoto, Japan

Tadashi Kani