Hitachi, Ltd.

Hitachi Car Engineering Co., Ltd.

Other

Tadashi Isono

Izumi Watanabe

Kaoru Uchiyama

Shinya Igarashi

Masuo Akamatsu

Masamichi Yamada

Chihiro Kobayashi

Terumi Nakazawa

Yoshiyuki Sasada

Akira Takasago

Kazuo Matsuura

Shiro Oouchi

Mamoru Ooba

Toshihiko Nakau

A high frequency antenna device is provided which includes: a high frequency antenna wiring board having a film antenna formed on one surface of a dielectric substrate made up of multiple, laminated ceramic layers and a high frequency circuit formed on the other surface of the dielectric substrate to generate a high frequency signal; a plate-like metal base having a square opening cut therethrough; and a cover to package a surface of the high frequency circuit on the high frequency antenna wiring board after the high frequency antenna wiring board has been fitted in the opening of the metal base; wherein a periphery of the high frequency antenna wiring board is airtightly sealed and joined to the metal base with glass or brazing metal.

High frequency antenna device and method of manufacturing the same, HF antenna printed circuit board for HF antenna device, and transmitting and receiving device using HF antenna device

A heating resistor type air flow rate measuring apparatus is provided with a couple of heating resistors placed at the positions where those resistors may each interfere thermally with respect to an air flow, and a couple of driving circuits for driving those heating resistors. The air flow rate signal is obtained by calculating the difference between the output signals of a couple of heating resistors in terms of heat radiation rate effected by an air flow, and adding the difference value onto the output signal of one of heating resistors.

Heating resistor type air flow rate measuring apparatus

A high frequency transmitter-receiver which can prevent an antenna pattern from being broken. A radar apparatus is provided with a high frequency antenna, a base plate and a module. The antenna is comprised of an organic substrate and a metal pattern formed on the organic substrate. The high frequency antenna is adhered to the base plate astride the module. Here, the gap between the base plate and the module where the antenna is adhered is configured to satisfy the expression (an amount of change in gap size with respect to a change in use temperature)&divide;(an original gap size)&lE;6%.

High frequency transmitter-receiver

A heating resistor type air flow rate measuring apparatus is provided with a couple of heating resistors placed at the positions where those resistors may each interfere thermally with respect to an air flow, and a couple of driving circuits for driving those heating resistors. The air flow rate signal is obtained by calculating the difference between the output signals of a couple of heating resistors in terms of heat radiation rate effected by an air flow, and adding the difference value onto the output signal of one of the heating resistors.

A measuring element for an air flow rate measuring apparatus has upstream and downstream heating resistors and first and second temperature compensating resistors paired with the upstream and downstream heating resistors, respectively. The resistors are mounted on an electrically insulated substrate positioned within an air flow. A substantial part of resistor film of the temperature compensating resistor paired with the upstream heating resistor is positioned upstream on the insulated substrate relative to the resistor film of the compensating resistor paired with the downstream heating resistor.

Air flow measuring element and air flow measuring apparatus therewith

A measuring element for a mass air flow sensor formed on a substrate for measuring a flow rate of an objective fluid comprises a pair of heated resistors of thin films juxtaposed in the flowing direction of the objective fluid, formed at a thin film heated resistor forming part on the substrate, a pair of non-heated ambient temperature sensing resistors of thin films, formed at a thin film ambient temperature sensing resistor forming part on the substrate, and a plurality of electrode terminals of thin films formed at a supporting part at which the substrate is supported, being a part excluding the heated resistor thin film forming part and the thin film ambient temperature sensing resistor forming part, for taking out electrical signals from the heated resisters and the non-heated ambient temperature sensing resistors, wherein the thin film heated resistor forming part and the thin film ambient temperature sensing resistor forming part are shifted each other and arranged before and after in the flowing direction of the fluid, and shifted and arranged left and right in the direction perpendicular to the flowing direction so that the pair of the heated resistors and the pair of the non-heated do not superimpose each other in the viewing direction parallel to the flowing direction, and the supporting part is allocated at one end side of the substrate, at which the plurality of electrode terminals of thin films are formed.

Growing community of inventors

Mito, Japan

Tadashi Isono