Other

Oki Electric Industry Co., Ltd.

Seiko Epson Corporation

Google Inc.

Tadashi Igarashi

Kenichi Shibata

Tracy Heims

Thomas Franz Enders

Yu Bai

Roger Nihl Re

Ian Allan Sorensen

Conor Ryan Kusich

Mark Alan Nohrnberg

Nicole Laferriere

Akinori Tsukuda

Hikaru Tomizawa

Munehiro Ando

Display mount for a game controller

A case for a mobile, electronic device, the case having a hard, clear case body with an outer surface and an inner surface facing the electronic device and at least one separator on the inner surface of the case body to create a space between the electronic device and the case body.

Mobile electronic device case

A case for a mobile, electronic device, the case having a case body with an outer surface and an inner surface facing the electronic device and at least one separator on the inner surface of the case body to create a space between the electronic device and the case body.

A form processing system makes it easier to handle forms generated in conjunction with product sales and thereby improves overall productivity. This form processing system processes forms generated in conjunction with product sales using a form printeras a form printing unit for printing forms using a form format suitable to the product purchased by a customer and specific form configuration data that is added to the form format. A receipt generatorused as a form reading unit then reads a completed form and generates form image data from the completed form. The completed form is a form that was printed by the form printer and then had additional information relating to the product sale recorded on the form. A form management databaseused as a form image storage unit then stores the form image data generated by the receipt generator. The productivity of forms processing and management is thus improved.

Form processing system and method

A method of manufacturing a semiconductor device, which is capable of reducing or preventing damage of wirings formed over a semiconductor substrate. The method of manufacturing the semiconductor device includes forming a wiring on the surface of a semiconductor substrate with a predetermined circuit formed thereon, forming a resin layer whose surface is substantially flat on the wiring, and processing the back of the semiconductor substrate after the formation of the resin layer.

Methods of manufacturing semiconductor devices that protect interconnect wirings during processing of back substrate surface

In a method, first and second circuit elements are provided on a surface of a semiconductor substrate; and a hole is formed in the semiconductor substrate between the first and second circuit elements. Then, the semiconductor substrate is divided at the hole to separate the first and second circuit elements from each other.

Semiconductor device and method for fabricating the same

Growing community of inventors

Tokyo, Japan

Tadashi Igarashi