Tokyo Electron Limited

Tadashi Enomoto

Masakazu Yamamoto

Nao Akashi

Makoto Saito

Yutai Matsuhashi

Mitsuhiro Tachibana

Keiichi Tanaka

Kiichi Takahashi

Kentaro Oshimo

Haruhiko Furuya

Barry Clarke

Youngtai Kang

Mitsuru Yamazaki

Keishi Shionaga

Toshiji Abe

Hiroyuki Karasawa

Tsutomu Sugawara

Jattie Van Der Linde

Kazuyoshi Sugawara

A semiconductor manufacturing apparatus includes: a gas introduction pipe connected to a processing container of the semiconductor manufacturing apparatus in order to introduce a gas into the processing container; and a temperature sensor provided in the gas introduction pipe in order to measure a temperature of a gas in the gas introduction pipe.

Semiconductor manufacturing apparatus including temperature sensor inside gas pipe and temperature control method thereof

An information processing apparatus for controlling a conveying apparatus to convey a substrate to be processed by a substrate processing apparatus includes a processor that performs operations including controlling the conveying apparatus, according to teaching data, to perform a first movement operation including putting the substrate into a container configured to carry the substrate and a second movement operation including getting the substrate from the container, acquiring image data including an image of a placement position for the substrate in the container during the first movement operation and the second movement operation, performing image processing on the image data to quantify a relationship between a position of the container and a position of the substrate, determining the quantified relationship to yield a determination result, and outputting correction data for correcting the conveying apparatus with respect to the first movement operation and the second movement operation, based on the determination result.

Information processing apparatus, transfer position correction method, and substrate processing apparatus

An information processing system includes a temperature measuring unit configured to measure a temperature distribution, in an array direction of substrates to be treated, at positions between a heater and the substrates in a treatment chamber, a memory, and a processor coupled to the memory and configured to perform a simulation of the temperature distribution during performing the heat treatment on the substrates in the treatment chamber, to obtain a standard-simulation temperature distribution by using a standard-simulation model of the heat treatment apparatus, modify the standard-simulation model to obtain an individual-simulation model in which an individual difference of the heat treatment apparatus is reflected, based on a difference between the measured temperature distribution and the obtained standard-simulation temperature distribution, perform the simulation of the temperature distribution to obtain an individual-simulation temperature distribution by using the obtained individual-simulation model, and correct a target temperature by using the obtained individual-simulation temperature distribution.

Information processing system, temperature control method, and heat treatment apparatus

An information processing apparatus executes a simulation of a state of a process which is being performed in a semiconductor manufacturing apparatus, by using a simulation model of the semiconductor manufacturing apparatus. The information processing apparatus includes: a physical sensor data acquisition unit that acquires physical sensor data measured in the semiconductor manufacturing apparatus that is performing the process according to process parameters; a simulation execution unit that executes the simulation by the simulation model according to the process parameters, thereby outputting virtual sensor data; a simulation result determination unit that performs a pre-detection of a part of the semiconductor manufacturing apparatus that needs to be replaced, based on a difference between the physical sensor data and the virtual sensor data; and a part order unit that orders the part of the semiconductor manufacturing apparatus based on a result of the pre-detection.

Information processing apparatus, information processing system, and part ordering method

An information processing apparatus of a substrate processing apparatus including a transport device includes an image data acquisition unit that acquires image data of a disposing position of a processing target substrate, a first image processing unit that digitizes a positional relationship among the transport source object, the transport device, and the substrate, a second image processing unit that digitizes a positional relationship among the transport destination object, the transport device, and the substrate, a first transfer teaching unit that outputs first correction data of the moving operation of the transport device of receiving the substrate from the transport source object, and a second transfer teaching unit that outputs second correction data of the moving operation of the transport device of disposing the substrate in the transport destination object.

Information processing apparatus for teaching transfer position of substrate, transfer position teaching method, and substrate processing apparatus including the information processing apparatus

A substrate processing apparatus includes: a chamber that accommodates a boat; a transfer mechanism that is provided inside the chamber, and transfers a substrate; a first camera that captures an image of a support column of the boat and the substrate; a support member that is inserted through an opening formed in a wall surface of the chamber, and supports the first camera; and a driver that drives the support member in order to move the first camera between a standby position and a measurement position.

Substrate processing apparatus and image capturing method

A transfer method transfers a substrate between a transfer unit configured to hold and transfer the substrate and a substrate stage serving as a transfer destination or a transfer source of the substrate. The transfer method includes: acquiring positional information of the transfer unit and positional information of the substrate stage; determining whether or not there is a risk for the substrate to contact with the substrate stage, based on the acquired positional information of the transfer unit and positional information of the substrate stage; and when determined that there is a risk for the substrate to contact with the substrate stage, notifying the risk according to the determination at the determining.

Transfer method and transfer system for transferring substrate between transfer device and substrate stage

Disclosed is a magnetizing apparatus including: a placing table configured to place thereon a storage container storing a plurality of substrates; a magnetizing chamber configured to accommodate the storage container and apply a magnetic field to the plurality of substrates in the storage container; and a conveying mechanism configured to convey the storage container from the placing table into the magnetizing chamber.

Magnetizing apparatus and magnetizing method

Disclosed is a magnetic annealing apparatus including a processing container that performs a magnetic annealing processing on a plurality of substrates accommodated therein in a magnetic field; a substrate holder that holds the plurality of substrates substantially horizontally in the processing container; a division heater including a plurality of sub-division heaters and covering a substantially entire circumferential surface of an outer periphery of a predetermined region of the processing container along a longitudinal direction; a magnet installed to cover an outside of the division heater; and a controller configured to feedback-control a temperature of a predetermined control target heater among the plurality of sub-division heaters, and to control temperatures of the plurality of sub-division heaters other than the predetermined control target heater based on a control output obtained by multiplying a control output of the predetermined control target heater and a predetermined ratio.

Magnetic annealing apparatus and magnetic annealing method

A vacuum processing apparatus is configured to include a process chamber, a turntable provided in the process chamber, and a substrate receiving area provided in one surface of the turntable and including a regulation part formed therearound to regulate a position of a substrate. A transfer mechanism is provided outside the process chamber, and a lifting member is configured to support the substrate and to move up and down in order to transfer the substrate between the transfer mechanism and the turntable. An exhaust mechanism is configured to selectively evacuate a gap between the substrate receiving area and the substrate before the lifting member places the substrate on the substrate receiving area.

Vacuum processing apparatus and vacuum processing method

A substrate processing apparatus includes a processing chamber; process areas each of which supplies a reaction gas; a turntable that rotates to cause a substrate to pass through the process areas; a gas nozzle provided in one of the process areas; a separating area that supplies a separation gas to separate atmospheres of the process areas; and a cover part configured to cover the gas nozzle and cause the reaction gas supplied from the gas nozzle to remain around the gas nozzle. The cover part includes an upstream side wall, a downstream side wall, and an upper wall. The cover part also includes a guide surface configured to guide the separation gas to flow over a lower part of the upstream side wall to a space above the upper wall. The distance between the gas nozzle and the upstream side wall is greater than or equal to 8 mm.

Growing community of inventors

Iwate, Japan

Tadashi Enomoto