Shin-etsu Chemical Co., Ltd.

Tadashi Amano

Shigehiro Hoshida

Shuji Ohnishi

Makoto Ooura

Takashi Kobayashi

Yoshitaka Okuno

Kazunori Kondo

Masahiro Usuki

Ryuichi Saito

Toshihiko Nakano

Tomohiro Inoue

Manabu Furudate

Minoru Shigemitsu

Yoshihiro Shirota

Yoshitsugu Eguchi

Junichi Watanabe

Toshimichi Koga

Takuya Ueda

Yasuhiro Takahashi

Hajime Kitamura

Hideshi Kurihara

Yoichi Tanifuji

Makoto Fujiwara

Michio Aizawa

Tadayoshi Hiyama

Yoshihiko Hirai

Mikio Watanabe

Toshio Shinohara

Ichiro Kaneko

Kaname Inoue

Ken Yahata

Toru Nakanishi

Tatsuya Fujimoto

Toshihiko Kawakubo

Masatsugu Takano

Toshiaki Maruyama

Masakuni Yamamoto

Fumiaki Adachi

Kikuo Nakajima

Tohru Nishikawa

Yoshinori Nakahara

Genji Noguki

Tokuji Abe

Kazuhiro Kumakura

Kouzou Kuwabara

Tomohisa Suzuki

Shiro Takahashi

Toyotaro Kuniyasu

Ichiro Hara

Yoshihrio Shirota

Toru Yokota

Fujio Sato

Tadaaki Kurokawa

An inorganic hydrophilic coating solution including (a) an aqueous solution containing an amorphous silicate compound obtained by hydrolyzing and condensing a tetrafunctional silicon compound having a purity of 99.0 mass % or greater in an aqueous medium in the presence of a basic compound at a temperature within a range from normal temperature to 170&#xb0; C., (b) water, and optionally, (c) not more than 30 mass % of an alcohol, a ketone, or a surfactant, where the concentration of the solid fraction derived from the aqueous solution containing the amorphous silicate compound is 0.01 to 2.0 mass % and the pH is 5 to 8; an inorganic hydrophilic coating film formed from a dried and cured product of the inorganic hydrophilic coating solution; a member having a substrate and the inorganic hydrophilic coating film formed on the surface of the substrate; and a cover panel for a solar cell module including the member.

Inorganic hydrophilic coating solution, hydrophilic coating film obtained therefrom, and member using same

Provided is a visible-light-responsive titanium oxide microparticle dispersion or the like readily enabling manufacture of a highly transparent photocatalyst thin film demonstrating photocatalyst activity even using visible light alone, and having exceptional titanium oxide microparticle dispersion stability even after storage for prolonged periods of time in cold and dark interior locations. The present invention makes it possible to: produce a peroxotitanic acid solution containing vanadium and a tin compound from a titanium compound, a vanadium compound, a tin compound, a basic substance, hydrogen peroxide, and an aqueous dispersion medium as starting materials; subject the peroxotitanic acid solution to a hydrothermal reaction under high pressure; subsequently admix a copper compound into the acid solution; and obtain a visible-light-responsive titanium oxide microparticle dispersion or the like.

Visible-light-responsive titanium oxide microparticle dispersion, method for manufacturing same, and member having surficial photocatalyst thin film formed using same dispersion

A method for manufacturing a microparticulate anatase or rutile titanium oxide dispersion from a peroxotitanic acid solution optionally containing tin, wherein the method for manufacturing an anatase or rutile titanium oxide dispersion is characterized in that the peroxotitanic acid solution is fed continuously to a flow reactor and subjected to hydrothermal treatment at 150 to 250&#xb0; C. and 0.5 to 10 MPa. The invention makes it possible to provide a method for manufacturing a microparticulate anatase or rutile titanium oxide dispersion having excellent stability in regard to the titanium oxide microparticles and enabling a high-transparency photocatalytic thin film to be produced, and to provide a member having a photocatalytic thin film formed on the surface using this dispersion.

Method for manufacturing microparticulate anatase or rutile titanium oxide dispersion and component having photocatalytic thin film on surface

Disclosed are: a visible-light-responsive titanium oxide microparticle dispersion comprising an aqueous dispersion medium and titanium oxide microparticles dispersed therein, and a peroxotitanium component, an iron component and/or a copper component and a tin component, wherein the content of the peroxotitanium component is 0.1 to 20 mass % relative to the titanium oxide content; and a process for producing a visible-light-responsive titanium oxide microparticle dispersion, comprising (1) producing peroxotitanic acid containing a tin compound from a raw material titanium compound, a tin compound and hydrogen peroxide, (2) heating an aqueous solution of peroxotitanic acid containing the tin compound to 80 to 250&#xb0; C. under a high pressure to produce a titanium oxide microparticle dispersion containing a peroxotitanium component and a tin component, and (3) adding an iron compound and/or a copper compound to the titanium oxide microparticle dispersion to cause a reaction between the iron compound and/or the copper compound with the dispersion.

Visible-light-responsive titanium oxide microparticle dispersion, and process for production thereof

A thermally expandable vinyl chloride resin composition is provided. It includes (A) 100 parts by mass of a vinyl chloride resin, (B) 5 to 200 parts by mass of an inorganic filler, (C) 10 to 300 parts by mass of a thermally expandable graphite, (D) 0.1 to 10 parts by mass of a fluororesin, and (E) 10 to 300 parts by mass of a phosphorus compound. The composition exhibits favorable thermal expansion properties and favorable shape retention following thermal expansion upon exposure to high temperatures.

Vinyl chloride resin composition and molded article thereof

The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density such as copper-clad laminates. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) specific phosphinate and/or diphosphonate compounds, and (F) an ion scavenger and/or a heavy metal deactivator.

Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) a specific polyphosphoric acid-melamine-based compound salt and/or polyphosphoric acid-diamine compound salt, and (F) an ion scavenger and/or a heavy metal deactivator.

Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and anti-migration properties. The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate. The adhesive sheet can be used for a method of bonding two substrates.

Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties). The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate.

The present invention provides an antistatic agent for vinyl chloride-based resins which can impart superior antistatic properties to the vinyl chloride-based resin, and which can thereby solve various problems arising from charging of the vinyl chloride-based resin with static electricity, a vinyl chloride-based resin composition containing this antistatic agent, and a method for manufacturing this composition. The present invention provides an antistatic agent for vinyl chloride-based resins which consists of silica particles containing at least 99.0% by mass of SiOand 0.00005% 80.5 ppm by mass or less of sodium, and which has such a particle size distribution that at least 98% by mass of the silica particles is occupied by the particles having a particle diameter in the range from 30 to 1,000 nm.

Antistatic agent for vinyl chloride-based resins, vinyl chloride-based resin composition containing the same, and method for manufacturing this composition

A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 &#x3bc;m, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 &#x3bc;m. The polyimide adhesive layer has a Tg&#x3e;400&#xb0; C.

Preparation of flexible copper foil/polyimide laminate

An adhesive sheet made of an acrylic adhesive composition comprising (A) an acrylic polymer containing carboxyl groups and having a Tg of 5-30&#xb0; C., (B) a resol phenolic resin, (C) an epoxy resin, and (D) a curing accelerator has improved heat resistance, processing and handling as well as good adhesion, and is suited for use in the manufacture of FPC.

Acrylic adhesive sheet

There is provided a process for producing a vinyl chloride-based polymer, in which a suspension polymerization of either vinyl chloride monomer, or a mixture of vinyl chloride monomer and another copolymerizable monomer, is conducted in a polymerization vessel fitted with a reflux condenser, the process including the steps of:

Process for producing vinyl chloride polymer

A polyimide precursor resin solution composition sheet having a solvent content of 1&#x2013;50% by weight and a thickness of 1&#x2013;10 microns has improved adhesion, forms a heat resistant polyimide layer when cured, and is advantageously used in the bonding of conductors to plastic films.

Polyimide precursor resin solution composition sheet

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Kamisu, Japan

Tadashi Amano